Nobuharu Tahara

Person

Osaka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Connection member and separation membrane module using the same
- Patent number 8,568,589
- Issue date Oct 29, 2013
- Nitto Denko Corporation
- Yasuhiro Uda
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Method of manufacturing wiring board
- Patent number 7,237,332
- Issue date Jul 3, 2007
- Nitto Denko Corporation
- Toshiyuki Kawashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing multilayer wiring board
- Patent number 7,121,000
- Issue date Oct 17, 2006
- Nitto Denko Corporation
- Toshiyuki Kawashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming composite insulating layer and process of produci...
- Patent number 7,022,373
- Issue date Apr 4, 2006
- Nitto Denko Corporation
- Nobuharu Tahara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing multilayer wiring board
- Patent number 7,017,264
- Issue date Mar 28, 2006
- Nitto Denko Corporation
- Kenichi Ikeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing metal foil
- Patent number 6,807,729
- Issue date Oct 26, 2004
- Nitto Denko Corporation
- Toshiyuki Kawashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of metal layer formation and metal foil-based layered product
- Patent number 6,773,572
- Issue date Aug 10, 2004
- Nitto Denko Corporation
- Toshiyuki Kawashima
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wiring board and method of manufacturing the same
- Patent number 6,761,790
- Issue date Jul 13, 2004
- Nitto Denko Corporation
- Toshiyuki Kawashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal foil laminated plate and method of manufacturing the same
- Patent number 6,759,082
- Issue date Jul 6, 2004
- Nitto Denk Corporation
- Kenichi Ikeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board prepreg and manufacturing method thereof
- Patent number 6,596,406
- Issue date Jul 22, 2003
- Nitto Denko Corporation
- Kenichi Ikeda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
CONNECTION MEMBER AND SEPARATION MEMBRANE MODULE USING THE SAME
- Publication number 20110000844
- Publication date Jan 6, 2011
- Yasuhiro Uda
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
Porous film and method for preparation thereof
- Publication number 20070172640
- Publication date Jul 26, 2007
- Nobuharu Tahara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Method of manufacturing wiring board
- Publication number 20040187305
- Publication date Sep 30, 2004
- Toshiyuki Kawashima
- B32 - LAYERED PRODUCTS
Information Patent Application
Method of forming composite insulating layer and process of produci...
- Publication number 20040170754
- Publication date Sep 2, 2004
- NITTO DENKO CORPORATION
- Nobuharu Tahara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for manufacturing multilayer wiring board
- Publication number 20040031147
- Publication date Feb 19, 2004
- Toshiyuki Kawashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Metal foil-based layered product and process for producing the same
- Publication number 20030148112
- Publication date Aug 7, 2003
- NITTO DENKO CORPORATION
- Toshiyuki Kawashima
- B32 - LAYERED PRODUCTS
Information Patent Application
Method of metal layer formation and metal foil-based layered product
- Publication number 20030129440
- Publication date Jul 10, 2003
- NITTO DENKO CORPORATION
- Toshiyuki Kawashima
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of manufacturing metal foil laminated product and method of...
- Publication number 20020189088
- Publication date Dec 19, 2002
- Toshiyuki Kawashima
- B32 - LAYERED PRODUCTS
Information Patent Application
Multilayer wiring board and method of manufacturing the same
- Publication number 20020192870
- Publication date Dec 19, 2002
- Kenichi Ikeda
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Metal foil laminated plate and method of manufacturing the same
- Publication number 20020172812
- Publication date Nov 21, 2002
- Kenichi Ikeda
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Wiring board and method of manufacturing the same
- Publication number 20020164467
- Publication date Nov 7, 2002
- Toshiyuki Kawashima
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Method of manufacturing wiring board
- Publication number 20020155271
- Publication date Oct 24, 2002
- Toshiyuki Kawashima
- B32 - LAYERED PRODUCTS
Information Patent Application
Wiring board prepreg and manufacturing method thereof
- Publication number 20020121334
- Publication date Sep 5, 2002
- Kenichi Ikeda
- B32 - LAYERED PRODUCTS

Nobuharu Tahara

Person

Patents Grantslast 30 patents

Connection member and separation membrane module using the same

Method of manufacturing wiring board

Method for manufacturing multilayer wiring board

Method of forming composite insulating layer and process of produci...

Method of manufacturing multilayer wiring board

Method of manufacturing metal foil

Method of metal layer formation and metal foil-based layered product

Wiring board and method of manufacturing the same

Metal foil laminated plate and method of manufacturing the same

Wiring board prepreg and manufacturing method thereof

Patents Applicationslast 30 patents

CONNECTION MEMBER AND SEPARATION MEMBRANE MODULE USING THE SAME

Porous film and method for preparation thereof

Method of manufacturing wiring board

Method of forming composite insulating layer and process of produci...

Method for manufacturing multilayer wiring board

Metal foil-based layered product and process for producing the same

Method of metal layer formation and metal foil-based layered product

Method of manufacturing metal foil laminated product and method of...

Multilayer wiring board and method of manufacturing the same

Metal foil laminated plate and method of manufacturing the same

Wiring board and method of manufacturing the same

Method of manufacturing wiring board

Wiring board prepreg and manufacturing method thereof