Nobuhiko Muraoka

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Toyonaka, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for mounting electronic component
- Patent number 5,854,745
- Issue date Dec 29, 1998
- Matsushita Electric Industrial Co., Ltd.
- Nobuhiko Muraoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for applying tape to object by applying pressure thereto
- Patent number 5,766,402
- Issue date Jun 16, 1998
- Matsushita Electric Industrial Co., Ltd.
- Nobuhiko Muraoka
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Bonding apparatus for terminal component
- Patent number 5,582,341
- Issue date Dec 10, 1996
- Matsushita Electric Industrial Co., Ltd.
- Shinji Kanayama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tape carrier package mounting apparatus with heaters for bonding tools
- Patent number 5,575,059
- Issue date Nov 19, 1996
- Matsushita Electric Industrial Co., Ltd.
- Nobuhiko Muraoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR