Nobuhiko Noto

Person

Annaka-shi, Gunma, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Reclaiming processing method for delaminated wafer
- Patent number 9,496,130
- Issue date Nov 15, 2016
- Shin-Etsu Handotai Co., Ltd.
- Toru Ishizuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing bonded wafer and bonded SOI wafer
- Patent number 8,987,109
- Issue date Mar 24, 2015
- Shin-Etsu Handotai Co., Ltd.
- Hiroji Aga
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Silicon epitaxial wafer, method for manufacturing the same, bonded...
- Patent number 8,823,130
- Issue date Sep 2, 2014
- Shin-Etsu Handotai Co., Ltd.
- Masahiro Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing bonded wafer
- Patent number 8,697,544
- Issue date Apr 15, 2014
- Shin-Etsu Handotai Co., Ltd.
- Tohru Ishizuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing bonded wafer
- Patent number 8,691,665
- Issue date Apr 8, 2014
- Shin-Etsu Handotai Co., Ltd.
- Satoshi Oka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SOI wafer, semiconductor device, and method for manufacturing SOI w...
- Patent number 8,466,538
- Issue date Jun 18, 2013
- Shin-Etsu Handotai Co., Ltd.
- Tohru Ishizuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SOI (silicon on insulator) structure semiconductor device and metho...
- Patent number 8,410,573
- Issue date Apr 2, 2013
- Denso Corporation
- Hiroshi Ohtsuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing bonded wafer
- Patent number 8,389,382
- Issue date Mar 5, 2013
- Shin-Etsu Handotai Co., Ltd.
- Satoshi Oka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing SOI wafer
- Patent number 8,361,888
- Issue date Jan 29, 2013
- Shin-Etsu Handotai Co., Ltd.
- Isao Yokokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing SOI substrate
- Patent number 8,338,277
- Issue date Dec 25, 2012
- Shin-Etsu Handotai Co., Ltd.
- Hiroshi Takeno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing SOI wafer
- Patent number 8,202,787
- Issue date Jun 19, 2012
- Shin-Etsu Handotai Co., Ltd.
- Tohru Ishizuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing bonded wafer
- Patent number 8,173,521
- Issue date May 8, 2012
- Shin-Etsu Handotai Co., Ltd.
- Norihiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing bonded wafer
- Patent number 8,097,523
- Issue date Jan 17, 2012
- Shin-Etsu Handotai Co., Ltd.
- Norihiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing semiconductor substrate
- Patent number 8,076,223
- Issue date Dec 13, 2011
- Shin-Etsu Handotai Co., Ltd.
- Satoshi Oka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming silicon oxide film of SOI wafer
- Patent number 8,053,334
- Issue date Nov 8, 2011
- Shin-Etsu Handotai Co., Ltd.
- Isao Yokokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing soi wafer
- Patent number 7,985,660
- Issue date Jul 26, 2011
- Shin-Etsu Handotai Co., Ltd.
- Isao Yokokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for measuring rotation angle of bonded wafer
- Patent number 7,861,421
- Issue date Jan 4, 2011
- Shin-Etsu Handotai Co., Ltd.
- Norihiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing SOI substrate
- Patent number 7,838,388
- Issue date Nov 23, 2010
- Shin-Etsu Handotai Co., Ltd.
- Satoshi Oka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing SOI substrate
- Patent number 7,799,660
- Issue date Sep 21, 2010
- Shin-Etsu Handotai Co., Ltd.
- Tohru Ishizuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing bonded wafer
- Patent number 7,776,719
- Issue date Aug 17, 2010
- Shin-Etsu Handotai Co., Ltd.
- Yasutsugu Soeta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing SOI substrate and SOI substrate
- Patent number 7,749,861
- Issue date Jul 6, 2010
- Shin-Etsu Handotai Co., Ltd.
- Hiroshi Takeno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating light-emitting device and light-emitting device
- Patent number 7,553,685
- Issue date Jun 30, 2009
- Shin-Etsu Handotai Co., Ltd.
- Nobuhiko Noto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing semiconductor wafer
- Patent number 7,550,309
- Issue date Jun 23, 2009
- Shin-Etsu Handotai Co., Ltd.
- Isao Yokokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device and method of fabricating the same
- Patent number 7,041,529
- Issue date May 9, 2006
- Shin-Etsu Handotai Co., Ltd.
- Masato Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and method of fabricating the same
- Patent number 6,995,401
- Issue date Feb 7, 2006
- Shin-Etsu Handotai Co., Ltd.
- Masato Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device
- Patent number 6,847,056
- Issue date Jan 25, 2005
- Shin-Etsu Handotai Co., Ltd.
- Nobuhiko Noto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device and method for manufacturing the same
- Patent number 6,787,383
- Issue date Sep 7, 2004
- Shin-Etsu Hanotai Co., Ltd.
- Shunichi Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting element and method for manufacturing the same
- Patent number 6,759,689
- Issue date Jul 6, 2004
- Shin-Etsu Handotai Co., Ltd.
- Keizo Adomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compound semiconductor single crystal and fabrication process for c...
- Patent number 6,589,447
- Issue date Jul 8, 2003
- Shin-Etsu Handotai Co., Ltd.
- Junya Ishizaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Algainp light-emitting device
- Patent number 5,739,553
- Issue date Apr 14, 1998
- Shin-Etsu Handotai, Co., Ltd.
- Nobuhiko Noto
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
RECLAIMING PROCESSING METHOD FOR DELAMINATED WAFER
- Publication number 20140273400
- Publication date Sep 18, 2014
- Shin-Etsu Handotai Co., Ltd.
- Toru Ishizuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING BONDED WAFER AND BONDED SOI WAFER
- Publication number 20140097523
- Publication date Apr 10, 2014
- Shin-Etsu Handotai Co., Ltd.
- Hiroji Aga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING BONDED WAFER
- Publication number 20130102126
- Publication date Apr 25, 2013
- Shin-Etsu Handotai Co., Ltd.
- Hiroji Aga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON EPITAXIAL WAFER, METHOD FOR MANUFACTURING THE SAME, BONDED...
- Publication number 20120326268
- Publication date Dec 27, 2012
- Shin-Etsu Handotai Co., Ltd.
- Masahiro Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING BONDED WAFER
- Publication number 20120244679
- Publication date Sep 27, 2012
- Shin-Etsu Handotai Co., Ltd.
- Satoshi Oka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SOI WAFER
- Publication number 20110281420
- Publication date Nov 17, 2011
- Shin-Etsu Handotai Co., Ltd.
- Hiroji Aga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING BONDED WAFER
- Publication number 20110237049
- Publication date Sep 29, 2011
- Shin-Etsu Handotai Co., Ltd.
- Satoshi Oka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SOI WAFER
- Publication number 20110223740
- Publication date Sep 15, 2011
- Shin-Etsu Handotai Co., Ltd.
- Tohru Ishizuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING BONDED WAFER
- Publication number 20110212598
- Publication date Sep 1, 2011
- Shin-Etsu Handotai Co., Ltd.
- Tohru Ishizuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING BONDED WAFER
- Publication number 20110104870
- Publication date May 5, 2011
- Shin-Etsu Handotai Co., Ltd.
- Norihiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SOI SUBSTRATE
- Publication number 20100323502
- Publication date Dec 23, 2010
- Shin-Etsu Handotai Co., Ltd.
- Hiroshi Takeno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOI WAFER, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SOI W...
- Publication number 20100314722
- Publication date Dec 16, 2010
- Shin-Etsu Handotai Co., Ltd.
- Tohru Ishizuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOI (SILICON ON INSULATOR) STRUCTURE SEMICONDUCTOR DEVICE AND METHO...
- Publication number 20100264510
- Publication date Oct 21, 2010
- Denso Corporation
- Hiroshi Ohtsuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MEASURING ROTATION ANGLE OF BONDED WAFER
- Publication number 20100132205
- Publication date Jun 3, 2010
- Shin-Etsu Handotai Co., Ltd.
- Norihiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SOI WAFER
- Publication number 20100129993
- Publication date May 27, 2010
- Shin-Etsu Handotai Co., Ltd.
- Isao Yokokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING BONDED WAFER
- Publication number 20100120223
- Publication date May 13, 2010
- Shin-Etsu Handotai Co., Ltd.
- Norihiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SOI WAFER
- Publication number 20100112781
- Publication date May 6, 2010
- Shin-Etsu Handotai Co., Ltd.
- Isao Yokokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SILICON OXIDE FILM OF SOI WAFER
- Publication number 20100112824
- Publication date May 6, 2010
- SHIN-ETSU HANDOTAI CO., LTD.
- Isao Yokokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF STRAINED SI SUBSTRATE
- Publication number 20100003803
- Publication date Jan 7, 2010
- Shin-Etsu Handotai Co., Ltd.
- Satoshi Oka
- C30 - CRYSTAL GROWTH
Information Patent Application
Method For Producing Semiconductor Substrate
- Publication number 20090305485
- Publication date Dec 10, 2009
- Shin-Etsu Handotai Co., Ltd.
- Satoshi Oka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for producing SOl substrate
- Publication number 20090258474
- Publication date Oct 15, 2009
- Shin-Etsu Handotai Co., Ltd.
- Satoshi Oka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing bonded wafer
- Publication number 20090170285
- Publication date Jul 2, 2009
- Shin-Etsu Handotai Co., Ltd.
- Yasutsugu Soeta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Manufacturing SOI Substrate and SOI Substrate
- Publication number 20090042361
- Publication date Feb 12, 2009
- Shin-Etsu Handotai Co., Ltd.
- Hiroshi Takeno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Manufacturing Bonded Wafer and Bonded Wafer
- Publication number 20080315349
- Publication date Dec 25, 2008
- Shin-Etsu Handotai Co., Ltd.
- Tokio Takei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing SOI substrate
- Publication number 20080261411
- Publication date Oct 23, 2008
- Shin-Etsu Handotai Co., Ltd.
- Tohru Ishizuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing Semiconductor Wafer
- Publication number 20080003785
- Publication date Jan 3, 2008
- Shin-Etsu Handotai Co., Ltd.
- Isao Yokokawa
- C30 - CRYSTAL GROWTH
Information Patent Application
Method For Producing Semiconductor Wafer
- Publication number 20070287269
- Publication date Dec 13, 2007
- Shin-Etsu Handotai Co., Ltd.
- Isao Yokokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for producing a semiconductor wafer
- Publication number 20060185581
- Publication date Aug 24, 2006
- Shin-Etsu Handotai Co., Ltd.
- Hiroji Aga
- C30 - CRYSTAL GROWTH
Information Patent Application
Method of fabricating light-emitting device and light-emitting device
- Publication number 20050285127
- Publication date Dec 29, 2005
- Shin-Etsu Handotai Co., Ltd.
- Nobuhiko Noto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Light emitting device and method of fabricating the same
- Publication number 20040206961
- Publication date Oct 21, 2004
- Shin-Etsu Handotai Co., Ltd.
- Masato Yamada
- H01 - BASIC ELECTRIC ELEMENTS

Nobuhiko Noto

Person

Patents Grantslast 30 patents

Reclaiming processing method for delaminated wafer

Method for manufacturing bonded wafer and bonded SOI wafer

Silicon epitaxial wafer, method for manufacturing the same, bonded...

Method for manufacturing bonded wafer

Method for producing bonded wafer

SOI wafer, semiconductor device, and method for manufacturing SOI w...

SOI (silicon on insulator) structure semiconductor device and metho...

Method for manufacturing bonded wafer

Method for manufacturing SOI wafer

Method for manufacturing SOI substrate

Method for manufacturing SOI wafer

Method for manufacturing bonded wafer

Method for manufacturing bonded wafer

Method for producing semiconductor substrate

Method for forming silicon oxide film of SOI wafer

Method for manufacturing soi wafer

Method for measuring rotation angle of bonded wafer

Method for producing SOI substrate

Method for manufacturing SOI substrate

Method for manufacturing bonded wafer

Method for manufacturing SOI substrate and SOI substrate

Method of fabricating light-emitting device and light-emitting device

Method for producing semiconductor wafer

Light-emitting device and method of fabricating the same

Light emitting device and method of fabricating the same

Light emitting device

Light-emitting device and method for manufacturing the same

Light emitting element and method for manufacturing the same

Compound semiconductor single crystal and fabrication process for c...

Algainp light-emitting device

Patents Applicationslast 30 patents

RECLAIMING PROCESSING METHOD FOR DELAMINATED WAFER

METHOD FOR MANUFACTURING BONDED WAFER AND BONDED SOI WAFER

METHOD FOR MANUFACTURING BONDED WAFER

SILICON EPITAXIAL WAFER, METHOD FOR MANUFACTURING THE SAME, BONDED...

METHOD FOR PRODUCING BONDED WAFER

METHOD FOR MANUFACTURING SOI WAFER

METHOD FOR MANUFACTURING BONDED WAFER

METHOD FOR MANUFACTURING SOI WAFER

METHOD FOR MANUFACTURING BONDED WAFER

METHOD FOR MANUFACTURING BONDED WAFER

METHOD FOR MANUFACTURING SOI SUBSTRATE

SOI WAFER, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SOI W...

SOI (SILICON ON INSULATOR) STRUCTURE SEMICONDUCTOR DEVICE AND METHO...

METHOD FOR MEASURING ROTATION ANGLE OF BONDED WAFER

METHOD FOR MANUFACTURING SOI WAFER

METHOD FOR MANUFACTURING BONDED WAFER

METHOD FOR MANUFACTURING SOI WAFER

METHOD FOR FORMING SILICON OXIDE FILM OF SOI WAFER

MANUFACTURING METHOD OF STRAINED SI SUBSTRATE

Method For Producing Semiconductor Substrate

Method for producing SOl substrate

Method for manufacturing bonded wafer

Method for Manufacturing SOI Substrate and SOI Substrate

Method for Manufacturing Bonded Wafer and Bonded Wafer

Method for manufacturing SOI substrate

Method for Producing Semiconductor Wafer

Method For Producing Semiconductor Wafer

Method for producing a semiconductor wafer

Method of fabricating light-emitting device and light-emitting device

Light emitting device and method of fabricating the same