Nobuhiko Yoshio

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Osaka, JP

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Patents Grantslast 30 patents

Information Patent Grant
Chip scale package type of semiconductor device
- Patent number 5,990,546
- Issue date Nov 23, 1999
- Nitto Denko Corporation
- Kazumasa Igarashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, production method thereof, and tape carrier f...
- Patent number 5,814,894
- Issue date Sep 29, 1998
- Nitto Denko Corporation
- Kazumasa Igarashi
- H01 - BASIC ELECTRIC ELEMENTS