Nobuhiro Suematsu

Follow

Person

Kyoto, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Resin molded semiconductor device and method for manufacturing the...
- Patent number 6,291,274
- Issue date Sep 18, 2001
- Matsushita Electric Industrial Co., Ltd.
- Seishi Oida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing resin-molded semiconductor device
- Patent number 6,258,314
- Issue date Jul 10, 2001
- Matsushita Electronics Corporation
- Seishi Oida
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method for manufacturing resin-molded semiconductor device
- Patent number 6,126,885
- Issue date Oct 3, 2000
- Matsushita Electronics Corporation
- Seishi Oida
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
Resin-molded semiconductor device and method for manufacturing the...
- Publication number 20010045640
- Publication date Nov 29, 2001
- Seishi Oida
- H01 - BASIC ELECTRIC ELEMENTS