Nobuhisa KUMAMOTO

Person

Kyoto-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Suction-holding apparatus and wafer polishing apparatus
- Patent number 9,583,376
- Issue date Feb 28, 2017
- Rohm Co., Ltd.
- Nobuhisa Kumamoto
- B24 - GRINDING POLISHING
Information Patent Grant
Process of producing semiconductor chip with surface interconnectio...
- Patent number 7,329,562
- Issue date Feb 12, 2008
- Rohm Co., Ltd.
- Nobuhisa Kumamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and production thereof, and semiconductor device...
- Patent number 7,045,900
- Issue date May 16, 2006
- Rohm Co., Ltd.
- Junichi Hikita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Damascene interconnection and semiconductor device
- Patent number 7,042,100
- Issue date May 9, 2006
- Rohm Co., Ltd.
- Koji Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 6,897,091
- Issue date May 24, 2005
- Rohm Co., Ltd.
- Junichi Hikita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Damascene interconnection and semiconductor device
- Patent number 6,879,049
- Issue date Apr 12, 2005
- Rohm Co., Ltd.
- Koji Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip, chip-on-chip structure device, and assembling m...
- Patent number 6,869,829
- Issue date Mar 22, 2005
- Rohm Co., Ltd.
- Junichi Hikita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and production thereof, and semiconductor device...
- Patent number 6,724,084
- Issue date Apr 20, 2004
- Rohm Co., Ltd.
- Junichi Hikita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and production process therefor
- Patent number 6,707,159
- Issue date Mar 16, 2004
- Rohm Co., Ltd.
- Nobuhisa Kumamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip, chip-on-chip structure device and assembling me...
- Patent number 6,476,499
- Issue date Nov 5, 2002
- Rohm Co.,
- Junichi Hikita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 6,451,689
- Issue date Sep 17, 2002
- Rohm Co., Ltd.
- Nobuhisa Kumamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with metal peripheral area
- Patent number 6,404,040
- Issue date Jun 11, 2002
- Rohm Co., Ltd
- Junichi Hikita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor chip
- Patent number 6,404,061
- Issue date Jun 11, 2002
- Rohm Co., Ltd.
- Junichi Hikita
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUCTION-HOLDING APPARATUS AND WAFER POLISHING APPARATUS
- Publication number 20140302755
- Publication date Oct 9, 2014
- ROHM CO., LTD.
- Nobuhisa KUMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip and production process therefor
- Publication number 20080138976
- Publication date Jun 12, 2008
- Rohm Co., Ltd.
- Nobuhisa Kumamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Damascene interconnection and semiconductor device
- Publication number 20050156332
- Publication date Jul 21, 2005
- Koji Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip and production thereof, and semiconductor device...
- Publication number 20040222521
- Publication date Nov 11, 2004
- Junichi Hikita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip and production process therefor
- Publication number 20040183208
- Publication date Sep 23, 2004
- Nobuhisa Kumamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip, chip-on-chip structure device, and assembling m...
- Publication number 20020190369
- Publication date Dec 19, 2002
- Junichi Hikita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20020127777
- Publication date Sep 12, 2002
- Junichi Hikita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plasma treatment apparatus and electrode used for the same
- Publication number 20010014374
- Publication date Aug 16, 2001
- Nobuhisa Kumamoto
- H01 - BASIC ELECTRIC ELEMENTS

Nobuhisa KUMAMOTO

Person

Patents Grantslast 30 patents

Suction-holding apparatus and wafer polishing apparatus

Process of producing semiconductor chip with surface interconnectio...

Semiconductor chip and production thereof, and semiconductor device...

Damascene interconnection and semiconductor device

Semiconductor device and manufacturing method thereof

Damascene interconnection and semiconductor device

Semiconductor chip, chip-on-chip structure device, and assembling m...

Semiconductor chip and production thereof, and semiconductor device...

Semiconductor chip and production process therefor

Semiconductor chip, chip-on-chip structure device and assembling me...

Method for manufacturing semiconductor device

Semiconductor device with metal peripheral area

Semiconductor device and semiconductor chip

Patents Applicationslast 30 patents

SUCTION-HOLDING APPARATUS AND WAFER POLISHING APPARATUS

Semiconductor chip and production process therefor

Damascene interconnection and semiconductor device

Semiconductor chip and production thereof, and semiconductor device...

Semiconductor chip and production process therefor

Semiconductor chip, chip-on-chip structure device, and assembling m...

Semiconductor device and manufacturing method thereof

Plasma treatment apparatus and electrode used for the same