Nobuhisa Kuroda

Person

Ogaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 11,678,440
- Issue date Jun 13, 2023
- Ibiden Co., Ltd.
- Yoji Sawada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 11,222,791
- Issue date Jan 11, 2022
- Ibiden Co., Ltd.
- Yoji Sawada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board
- Patent number 10,314,166
- Issue date Jun 4, 2019
- Ibiden Co., Ltd.
- Nobuhisa Kuroda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board with built-in electronic component and method for manu...
- Patent number 9,930,791
- Issue date Mar 27, 2018
- Ibiden Co., Ltd.
- Mitsuhiro Tomikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board with built-in electronic component and method for manu...
- Patent number 9,743,534
- Issue date Aug 22, 2017
- Ibiden Co., Ltd.
- Mitsuhiro Tomikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer printed wiring board for mounting semiconductor element
- Patent number 9,374,903
- Issue date Jun 21, 2016
- Ibiden Co., Ltd.
- Naoki Katsuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing printed wiring board and printed wiring board
- Patent number 9,185,806
- Issue date Nov 10, 2015
- Ibiden Co., Ltd.
- Fumitaka Takagi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and manufacturing method thereof
- Patent number 8,309,856
- Issue date Nov 13, 2012
- Ibiden Co., Ltd.
- Nobuhisa Kuroda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method for manufacturing the same
- Patent number 8,110,752
- Issue date Feb 7, 2012
- Ibiden Co., Ltd.
- Fusaji Nagaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WIRING SUBSTRATE
- Publication number 20240260197
- Publication date Aug 1, 2024
- IBIDEN CO., LTD.
- Nobuhisa KURODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240244762
- Publication date Jul 18, 2024
- IBIDEN CO., LTD.
- Nobuhisa KURODA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240206061
- Publication date Jun 20, 2024
- IBIDEN CO., LTD.
- Ryo ANDO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20200365418
- Publication date Nov 19, 2020
- IBIDEN CO., LTD.
- Yoji SAWADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20200367368
- Publication date Nov 19, 2020
- IBIDEN CO., LTD.
- Yoji SAWADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20160212854
- Publication date Jul 21, 2016
- IBIDEN CO., LTD.
- Nobuhisa KURODA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANU...
- Publication number 20160105957
- Publication date Apr 14, 2016
- IBIDEN CO., LTD.
- Mitsuhiro TOMIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANU...
- Publication number 20160105966
- Publication date Apr 14, 2016
- IBIDEN CO., LTD.
- Mitsuhiro TOMIKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140353017
- Publication date Dec 4, 2014
- IBIDEN CO., LTD.
- Kota NODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER PRINTED WIRING BOARD FOR MOUNTING SEMICONDUCTOR ELEMENT
- Publication number 20140262447
- Publication date Sep 18, 2014
- IBIDEN CO., LTD.
- Naoki KATSUDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND PRINTED WIRING BOARD
- Publication number 20140090877
- Publication date Apr 3, 2014
- IBIDEN CO., LTD.
- Fumitaka TAKAGI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20090260853
- Publication date Oct 22, 2009
- IBIDEN CO., LTD.
- Fusaji Nagaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20090114431
- Publication date May 7, 2009
- IBIDEN CO., LTD.
- Nobuhisa Kuroda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Nobuhisa Kuroda

Person

Patents Grantslast 30 patents

Printed wiring board and method for manufacturing printed wiring board

Printed wiring board and method for manufacturing printed wiring board

Printed wiring board

Wiring board with built-in electronic component and method for manu...

Wiring board with built-in electronic component and method for manu...

Multilayer printed wiring board for mounting semiconductor element

Method for manufacturing printed wiring board and printed wiring board

Circuit board and manufacturing method thereof

Wiring substrate and method for manufacturing the same

Patents Applicationslast 30 patents

WIRING SUBSTRATE

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

WIRING SUBSTRATE

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

PRINTED WIRING BOARD

WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANU...

WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANU...

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

MULTILAYER PRINTED WIRING BOARD FOR MOUNTING SEMICONDUCTOR ELEMENT

METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND PRINTED WIRING BOARD

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF