Nobuhisa Onai

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Ota-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Methods and apparatus for improved bonding
- Patent number 10,050,009
- Issue date Aug 14, 2018
- Semiconductor Components Industries, LLC
- Nobuhisa Onai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit device and method for manufacturing same
- Patent number 9,572,294
- Issue date Feb 14, 2017
- Semiconductor Components Industries, LLC
- Nobuhisa Onai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS AND APPARATUS FOR IMPROVED BONDING
- Publication number 20170077061
- Publication date Mar 16, 2017
- Semiconductor Components Industries, LLC
- Nobuhisa ONAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20130286594
- Publication date Oct 31, 2013
- ON SEMICONDUCTOR TRADING LTD.
- Nobuhisa Onai
- H01 - BASIC ELECTRIC ELEMENTS