Nobuki Tanaka

Person

Tochigi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Resin composition and semiconductor device produced by using the same
- Patent number 8,853,312
- Issue date Oct 7, 2014
- Sumitomo Bakelite Co., Ltd.
- Hikaru Okubo
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Epoxy resin composition, prepreg, metal-clad laminate, printed wiri...
- Patent number 8,852,734
- Issue date Oct 7, 2014
- Sumitomo Bakelite Company, Ltd.
- Nobuki Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition and semiconductor device produced by using the same
- Patent number 8,614,270
- Issue date Dec 24, 2013
- Sumitomo Bakelite Company, Ltd.
- Hikaru Okubo
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Resin composition and semiconductor device produced by using the same
- Patent number 8,088,308
- Issue date Jan 3, 2012
- Sumitomo Bakelite Company, Ltd.
- Hikaru Okubo
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Die-attaching paste and semiconductor device
- Patent number 6,861,013
- Issue date Mar 1, 2005
- Sumitomo Bakelite Company, Ltd.
- Nobuki Tanaka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
RESIN COMPOSITION AND SEMICONDUCTOR DEVICE PRODUCED BY USING THE SAME
- Publication number 20130109798
- Publication date May 2, 2013
- SUMITOMO BAKELITE CO., LTD.
- Hikaru OKUBO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
EPOXY RESIN COMPOSITION FOR CIRCUIT BOARD, PREPREG, LAMINATE, RESIN...
- Publication number 20130037310
- Publication date Feb 14, 2013
- SUMITOMO BAKELITE CO., LTD.
- Michio Kimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION AND SEMICONDUCTOR DEVICE PRODUCED BY USING THE SAME
- Publication number 20120068106
- Publication date Mar 22, 2012
- Sumitomo Bakelite Company, Ltd.
- Hikaru OKUBO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PREPREG, LAMINATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE
- Publication number 20110194261
- Publication date Aug 11, 2011
- Nobuki TANAKA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
EPOXY RESIN COMPOSITION, PREPREG, METAL-CLAD LAMINATE, PRINTED WIRI...
- Publication number 20110083890
- Publication date Apr 14, 2011
- Sumitomo Bakelite Company, Ltd.
- Nobuki TANAKA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Resin Composition and Semiconductor Device Produced By Using the Same
- Publication number 20070213467
- Publication date Sep 13, 2007
- Hikaru Okubo
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Die-attaching paste and semiconductor device
- Publication number 20030146521
- Publication date Aug 7, 2003
- Nobuki Tanaka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Nobuki Tanaka

Person

Patents Grantslast 30 patents

Resin composition and semiconductor device produced by using the same

Epoxy resin composition, prepreg, metal-clad laminate, printed wiri...

Resin composition and semiconductor device produced by using the same

Resin composition and semiconductor device produced by using the same

Die-attaching paste and semiconductor device

Patents Applicationslast 30 patents

RESIN COMPOSITION AND SEMICONDUCTOR DEVICE PRODUCED BY USING THE SAME

EPOXY RESIN COMPOSITION FOR CIRCUIT BOARD, PREPREG, LAMINATE, RESIN...

RESIN COMPOSITION AND SEMICONDUCTOR DEVICE PRODUCED BY USING THE SAME

PREPREG, LAMINATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE

EPOXY RESIN COMPOSITION, PREPREG, METAL-CLAD LAMINATE, PRINTED WIRI...

Resin Composition and Semiconductor Device Produced By Using the Same

Die-attaching paste and semiconductor device