Nobuki Ueta

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Sakura-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Component-embedded substrate
- Patent number 11,979,986
- Issue date May 7, 2024
- Fujikura Ltd.
- Masakazu Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component-embedded substrate
- Patent number 11,638,351
- Issue date Apr 25, 2023
- Fujikura Ltd.
- Masakazu Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer wiring board and method of manufacturing the same
- Patent number 9,907,189
- Issue date Feb 27, 2018
- Fujikura Ltd.
- Nobuki Ueta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component built-in board mounting body and method of manufacturing...
- Patent number 9,635,763
- Issue date Apr 25, 2017
- Fujikura Ltd.
- Nobuki Ueta
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COMPONENT-EMBEDDED SUBSTRATE
- Publication number 20230232532
- Publication date Jul 20, 2023
- FUJIKURA LTD.
- Masakazu Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT-EMBEDDED SUBSTRATE
- Publication number 20210195741
- Publication date Jun 24, 2021
- FUJIKURA LTD.
- Masakazu Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYER WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140311773
- Publication date Oct 23, 2014
- FUJIKURA LTD.
- Nobuki Ueta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT BUILT-IN BOARD MOUNTING BODY AND METHOD OF MANUFACTURING...
- Publication number 20140211437
- Publication date Jul 31, 2014
- FUJIKURA LTD.
- Nobuki Ueta
- H01 - BASIC ELECTRIC ELEMENTS