Nobumori Ogoshi

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method for using a test wafer by forming modified layer using a las...
- Patent number 10,249,547
- Issue date Apr 2, 2019
- DISCO CORPORTATION
- Satoshi Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser processing method for workpiece
- Patent number 9,034,735
- Issue date May 19, 2015
- Disco Corporation
- Shigefumi Okada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer dividing method and wafer dividing apparatus
- Patent number 7,544,587
- Issue date Jun 9, 2009
- Disco Corporation
- Yosuke Watanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
LASER PROCESSING APPARATUS
- Publication number 20230219164
- Publication date Jul 13, 2023
- Disco Corporation
- Taizo KISE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
TEST WAFER AND USING METHOD THEREFOR
- Publication number 20170040235
- Publication date Feb 9, 2017
- Disco Corporation
- Satoshi Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER PROCESSING METHOD FOR WORKPIECE
- Publication number 20140106545
- Publication date Apr 17, 2014
- Disco Corporation
- Shigefumi Okada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wafer dividing method and wafer dividing apparatus
- Publication number 20070164073
- Publication date Jul 19, 2007
- DISCO CORPORATION
- Yosuke Watanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Processing method and apparatus using laser beam
- Publication number 20060249496
- Publication date Nov 9, 2006
- DISCO CORPORATION
- Hiroshi Morikazu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR