Nobuo Hayasaka

Person

Yokosuka-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Reliability evaluation test apparatus, reliability evaluation test...
- Patent number 8,456,186
- Issue date Jun 4, 2013
- Tokyo Electron Limited
- Kiyoshi Takekoshi
- G01 - MEASURING TESTING
Information Patent Grant
Multichip semiconductor device, chip therefor and method of formati...
- Patent number 8,283,755
- Issue date Oct 9, 2012
- Kabushiki Kaisha Toshiba
- Nobuo Hayasaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip semiconductor device, chip therefor and method of formati...
- Patent number 8,174,093
- Issue date May 8, 2012
- Kabushiki Kaisha Toshiba
- Nobuo Hayasaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip semiconductor device, chip therefor and method of formati...
- Patent number 7,829,975
- Issue date Nov 9, 2010
- Kabushiki Kaisha Toshiba
- Nobuo Hayasaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of performing electrolytic treatment on a conductive layer o...
- Patent number 7,387,717
- Issue date Jun 17, 2008
- Ebara Corporation
- Junji Kunisawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multichip semiconductor device, chip therefor and method of formati...
- Patent number 7,335,517
- Issue date Feb 26, 2008
- Kabushiki Kaisha Toshiba
- Nobuo Hayasaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliability evaluation test apparatus, reliability evaluation test...
- Patent number 7,242,206
- Issue date Jul 10, 2007
- Tokyo Electron Limited
- Kiyoshi Takekoshi
- G01 - MEASURING TESTING
Information Patent Grant
Reliability evaluation test apparatus, reliability evaluation test...
- Patent number 7,091,733
- Issue date Aug 15, 2006
- Tokyo Electron Limited
- Kiyoshi Takekoshi
- G01 - MEASURING TESTING
Information Patent Grant
Paste including a mixture of powders, connection plug, burying meth...
- Patent number 7,049,223
- Issue date May 23, 2006
- Kabushiki Kaisha Toshiba
- Keiichi Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a probe pin for testing electrical character...
- Patent number 7,032,307
- Issue date Apr 25, 2006
- Kabushiki Kaisha Toshiba
- Noriaki Matsunaga
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device using damascene technique and manufacturing me...
- Patent number 6,977,228
- Issue date Dec 20, 2005
- Kabushiki Kaisha Toshiba
- Yusuke Kohyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 6,946,387
- Issue date Sep 20, 2005
- Kabushiki Kaisha Toshiba
- Junichi Wada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device and method of manufacturing the same
- Patent number 6,933,205
- Issue date Aug 23, 2005
- Kabushiki Kaisha Toshiba
- Mie Matsuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fine particle film forming apparatus and method and semiconductor d...
- Patent number 6,933,216
- Issue date Aug 23, 2005
- Kabushiki Kaisha Toshiba
- Atsuko Sakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High precision pattern forming method of manufacturing a semiconduc...
- Patent number 6,846,750
- Issue date Jan 25, 2005
- Kabushiki Kaisha Toshiba
- Tokuhisa Ohiwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 6,828,684
- Issue date Dec 7, 2004
- Kabushiki Kaisha Toshiba
- Hiroshi Ikegami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip semiconductor device, chip therefor and method of formati...
- Patent number 6,809,421
- Issue date Oct 26, 2004
- Kabushiki Kaisha Toshiba
- Nobuo Hayasaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact probe with guide unit and fabrication method thereof
- Patent number 6,784,680
- Issue date Aug 31, 2004
- Sumitomo Electric Industries, Ltd.
- Tsuyoshi Haga
- G01 - MEASURING TESTING
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 6,746,969
- Issue date Jun 8, 2004
- Kabushiki Kaisha Toshiba
- Miyoko Shimada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 6,737,363
- Issue date May 18, 2004
- Kabushiki Kaisha Toshiba
- Hideshi Miyajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing system in electronic devices
- Patent number 6,730,447
- Issue date May 4, 2004
- Kabushiki Kaisha Toshiba
- Shinichi Ito
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Probe pin for testing electrical characteristics of apparatus, prob...
- Patent number 6,724,208
- Issue date Apr 20, 2004
- Kabushiki Kaisha Toshiba
- Noriaki Matsunaga
- G01 - MEASURING TESTING
Information Patent Grant
Apparatus and method for laser beam machining, and method for manuf...
- Patent number 6,720,522
- Issue date Apr 13, 2004
- Kabushiki Kaisha Toshiba
- Hiroshi Ikegami
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked type semiconductor device
- Patent number 6,717,251
- Issue date Apr 6, 2004
- Kabushiki Kaisha Toshiba
- Mie Matsuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, its manufacturing process, position matching...
- Patent number 6,709,966
- Issue date Mar 23, 2004
- Kabushiki Kaisha Toshiba
- Yoshimi Hisatsune
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 6,673,704
- Issue date Jan 6, 2004
- Kabushiki Kaisha Toshiba
- Junichi Wada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Paste including a mixture of powders, connection plug, burying meth...
- Patent number 6,657,306
- Issue date Dec 2, 2003
- Kabushiki Kaisha Toshiba
- Keiichi Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating apparatus
- Patent number 6,632,335
- Issue date Oct 14, 2003
- Ebara Corporation
- Junji Kunisawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked circuit device and method for evaluating an integrated circ...
- Patent number 6,614,106
- Issue date Sep 2, 2003
- Kabushiki Kaisha Toshiba
- Mie Matsuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device using damascene technique and manufacturing me...
- Patent number 6,608,356
- Issue date Aug 19, 2003
- Kabushiki Kaisha Toshiba
- Yusuke Kohyama
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Multichip semiconductor device, chip therefor and method of formati...
- Publication number 20110215443
- Publication date Sep 8, 2011
- Kabushiki Kaisha Toshiba
- Nobuo Hayasaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multichip semiconductor device, chip therefor and method of formati...
- Publication number 20110101522
- Publication date May 5, 2011
- Kabushiki Kaisha Toshiba
- Nobuo Hayasaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATING APPARATUS
- Publication number 20080296165
- Publication date Dec 4, 2008
- Junji Kunisawa
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS
- Publication number 20080251385
- Publication date Oct 16, 2008
- Junji Kunisawa
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Multichip semiconductor device, chip therefor and method of formati...
- Publication number 20080237888
- Publication date Oct 2, 2008
- Kabushiki Kaisha Toshiba
- Nobuo Hayasaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABILITY EVALUATION TEST APPARATUS, RELIABILITY EVALUATION TEST...
- Publication number 20080018355
- Publication date Jan 24, 2008
- Kiyoshi Takekoshi
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor device using damascene technique and manufacturing me...
- Publication number 20060084273
- Publication date Apr 20, 2006
- KABUSHIKI KAISHA TOSHIBA
- Yusuke Kohyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reliability evaluation test apparatus, reliability evaluation test...
- Publication number 20050253575
- Publication date Nov 17, 2005
- Kiyoshi Takekoshi
- G01 - MEASURING TESTING
Information Patent Application
Fine particle film forming apparatus and method and semiconductor d...
- Publication number 20050124164
- Publication date Jun 9, 2005
- Kabushiki Kaisha Toshiba
- Atsuko Sakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multichip semiconductor device, chip therefor and method of formati...
- Publication number 20050014311
- Publication date Jan 20, 2005
- Kabushiki Kaisha Toshiba
- Nobuo Hayasaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating a probe pin for testing electrical character...
- Publication number 20040196058
- Publication date Oct 7, 2004
- Kabushiki Kaisha Toshiba
- Noriaki Matsunaga
- G01 - MEASURING TESTING
Information Patent Application
Method of manufacturing semiconductor device
- Publication number 20040192034
- Publication date Sep 30, 2004
- Kabushiki Kaisha Toshiba
- Tokuhisa Ohiwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reliability evaluation test apparatus, reliability evaluation test...
- Publication number 20040183561
- Publication date Sep 23, 2004
- Kiyoshi Takekoshi
- G01 - MEASURING TESTING
Information Patent Application
Manufacturing system in electronic devices
- Publication number 20040168632
- Publication date Sep 2, 2004
- Kabushiki Kaisha Toshiba
- Shinichi Ito
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Plating apparatus
- Publication number 20040069646
- Publication date Apr 15, 2004
- Junji Kunisawa
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Semiconductor device and method for manufacturing the same
- Publication number 20040043602
- Publication date Mar 4, 2004
- KABUSHIKI KAISHA TOSHIBA
- Junichi Wada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Paste including a mixture of powders, connection plug, burying meth...
- Publication number 20040043596
- Publication date Mar 4, 2004
- KABUSHIKI KAISHA TOSHIBA
- Keiichi Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact probe with guide unit and fabrication method thereof
- Publication number 20030210063
- Publication date Nov 13, 2003
- Sumitomo Electric Industries, Ltd.
- Tsuyoshi Haga
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20030181041
- Publication date Sep 25, 2003
- Kabushiki Kaisha Toshiba
- Hiroshi Ikegami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device using damascene technique and manufacturing me...
- Publication number 20030162396
- Publication date Aug 28, 2003
- KABUSHIKI KAISHA TOSHIBA
- Yusuke Kohyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fine particle film forming apparatus and method and semiconductor d...
- Publication number 20030122252
- Publication date Jul 3, 2003
- Kabushiki Kaisha Toshiba
- Atsuko Sakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit device and method of manufacturing the same
- Publication number 20030067052
- Publication date Apr 10, 2003
- Kabushiki Kaisha Toshiba
- Mie Matsuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for manufacturing the same
- Publication number 20020192938
- Publication date Dec 19, 2002
- KABUSHIKI KAISHA TOSHIBA
- Junichi Wada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method, system and program product for trading electronic products
- Publication number 20020143656
- Publication date Oct 3, 2002
- Kabushiki Kaisha Toshiba
- Mie Matsuo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Manufacturing system in electronic devices
- Publication number 20020136971
- Publication date Sep 26, 2002
- Kabushiki Kaisha
- Shinichi Ito
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Probe pin for testing electrical characteristics of apparatus, prob...
- Publication number 20020127812
- Publication date Sep 12, 2002
- Kabushiki Kaisha Toshiba
- Noriaki Matsunaga
- G01 - MEASURING TESTING
Information Patent Application
Method of manufacturing semiconductor device
- Publication number 20020081863
- Publication date Jun 27, 2002
- Miyoko Shimada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor device
- Publication number 20020061657
- Publication date May 23, 2002
- Kabushiki Kaisha Toshiba
- Hideshi Miyajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20020050647
- Publication date May 2, 2002
- Kabushiki Kaisha Toshiba
- Hiroshi Ikegami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for laser beam machining, and method for manuf...
- Publication number 20020050489
- Publication date May 2, 2002
- Kabushiki Kaisha Toshiba
- Hiroshi Ikegami
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Nobuo Hayasaka

Person

Patents Grantslast 30 patents

Reliability evaluation test apparatus, reliability evaluation test...

Multichip semiconductor device, chip therefor and method of formati...

Multichip semiconductor device, chip therefor and method of formati...

Multichip semiconductor device, chip therefor and method of formati...

Method of performing electrolytic treatment on a conductive layer o...

Multichip semiconductor device, chip therefor and method of formati...

Reliability evaluation test apparatus, reliability evaluation test...

Reliability evaluation test apparatus, reliability evaluation test...

Paste including a mixture of powders, connection plug, burying meth...

Method for fabricating a probe pin for testing electrical character...

Semiconductor device using damascene technique and manufacturing me...

Semiconductor device and method for manufacturing the same

Integrated circuit device and method of manufacturing the same

Fine particle film forming apparatus and method and semiconductor d...

High precision pattern forming method of manufacturing a semiconduc...

Semiconductor device and method of manufacturing the same

Multichip semiconductor device, chip therefor and method of formati...

Contact probe with guide unit and fabrication method thereof

Method of manufacturing semiconductor device

Method of manufacturing semiconductor device

Manufacturing system in electronic devices

Probe pin for testing electrical characteristics of apparatus, prob...

Apparatus and method for laser beam machining, and method for manuf...

Stacked type semiconductor device

Semiconductor device, its manufacturing process, position matching...

Semiconductor device and method of manufacturing the same

Paste including a mixture of powders, connection plug, burying meth...

Plating apparatus

Stacked circuit device and method for evaluating an integrated circ...

Semiconductor device using damascene technique and manufacturing me...

Patents Applicationslast 30 patents

Multichip semiconductor device, chip therefor and method of formati...

Multichip semiconductor device, chip therefor and method of formati...

PLATING APPARATUS

PLATING APPARATUS

Multichip semiconductor device, chip therefor and method of formati...

RELIABILITY EVALUATION TEST APPARATUS, RELIABILITY EVALUATION TEST...

Semiconductor device using damascene technique and manufacturing me...

Reliability evaluation test apparatus, reliability evaluation test...

Fine particle film forming apparatus and method and semiconductor d...

Multichip semiconductor device, chip therefor and method of formati...

Method for fabricating a probe pin for testing electrical character...

Method of manufacturing semiconductor device

Reliability evaluation test apparatus, reliability evaluation test...

Manufacturing system in electronic devices

Plating apparatus

Semiconductor device and method for manufacturing the same

Paste including a mixture of powders, connection plug, burying meth...

Contact probe with guide unit and fabrication method thereof

Semiconductor device and method of manufacturing the same

Semiconductor device using damascene technique and manufacturing me...

Fine particle film forming apparatus and method and semiconductor d...

Integrated circuit device and method of manufacturing the same

Semiconductor device and method for manufacturing the same

Method, system and program product for trading electronic products

Manufacturing system in electronic devices

Probe pin for testing electrical characteristics of apparatus, prob...

Method of manufacturing semiconductor device

Method of manufacturing semiconductor device

Semiconductor device and method of manufacturing the same

Apparatus and method for laser beam machining, and method for manuf...