Nobuo Iwase

Person

Yokosuka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and semiconductor mounting part
- Patent number 5,909,058
- Issue date Jun 1, 1999
- Kabushiki Kaisha Toshiba
- Keiichi Yano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and electronic component connecting structure
- Patent number 5,907,187
- Issue date May 25, 1999
- Kabushiki Kaisha Toshiba
- Kaoru Koiwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic circuit board having a thermal conductivity substrate
- Patent number 5,622,769
- Issue date Apr 22, 1997
- Kabushiki Kaisha Toshiba
- Shoji Kozuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board
- Patent number 5,412,160
- Issue date May 2, 1995
- Kabushiki Kaisha Toshiba
- Takaaki Yasumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board
- Patent number 5,326,623
- Issue date Jul 5, 1994
- Kabushiki Kaisha Toshiba
- Koji Yamakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board including an aluminum nitride substrate and a multila...
- Patent number 5,041,700
- Issue date Aug 20, 1991
- Kabushiki Kaisha Toshiba
- Kiyoshi Iyogi
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Electronic device having a cooling element
- Patent number 5,008,582
- Issue date Apr 16, 1991
- Kabushiki Kaisha Toshiba
- Chiaki Tanuma
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Bump and method of manufacturing the same
- Patent number 4,970,571
- Issue date Nov 13, 1990
- Kabushiki Kaisha Toshiba
- Koji Yamakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board
- Patent number 4,963,701
- Issue date Oct 16, 1990
- Kabushiki Kaisha Toshiba
- Takaaki Yasumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Brazing paste
- Patent number 4,919,731
- Issue date Apr 24, 1990
- Kabushiki Kaisha Toshiba
- Kiyoshi Iyogi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit substrate and producing method of the same
- Patent number 4,916,261
- Issue date Apr 10, 1990
- Kabushiki Kaisha Toshiba
- Truong D. Thanh
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Method of manufacturing semiconductor device and apparatus therefor
- Patent number 4,906,341
- Issue date Mar 6, 1990
- Kabushiki Kaisha Toshiba
- Koji Yamakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing electronic parts including transfer of bump...
- Patent number 4,855,251
- Issue date Aug 8, 1989
- Kabushiki Kaisha Toshiba
- Kiyoshi Iyogi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component parts and method for manufacturing the same
- Patent number 4,835,344
- Issue date May 30, 1989
- Kabushiki Kaisha Toshiba
- Kiyoshi Iyogi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic circuit substrates and methods of manufacturing same
- Patent number 4,797,530
- Issue date Jan 10, 1989
- Kabushiki Kaisha Toshiba
- Nobuo Iwase
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Thick film capacitor
- Patent number 4,772,985
- Issue date Sep 20, 1988
- Kabushiki Kaisha Toshiba
- Takaaki Yasumoto
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Circuit substrate having high thermal conductivity
- Patent number 4,659,611
- Issue date Apr 21, 1987
- Kabushiki Kaisha Toshiba
- Nobuo Iwase
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Production of resistor from insulating material by local heating
- Patent number 4,584,456
- Issue date Apr 22, 1986
- Tokyo Shibaura Denki Kabushiki Kaisha
- Hirosi Oodaira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a hybrid integrated circuit device
- Patent number 4,412,377
- Issue date Nov 1, 1983
- Tokyo Shibaura Denki Kabushiki Kaisha
- Kenji Nagashima
- H01 - BASIC ELECTRIC ELEMENTS

Nobuo Iwase

Person

Patents Grantslast 30 patents

Semiconductor package and semiconductor mounting part

Electronic component and electronic component connecting structure

Ceramic circuit board having a thermal conductivity substrate

Circuit board

Circuit board

Circuit board including an aluminum nitride substrate and a multila...

Electronic device having a cooling element

Bump and method of manufacturing the same

Circuit board

Brazing paste

Circuit substrate and producing method of the same

Method of manufacturing semiconductor device and apparatus therefor

Method of manufacturing electronic parts including transfer of bump...

Electronic component parts and method for manufacturing the same

Ceramic circuit substrates and methods of manufacturing same

Thick film capacitor

Circuit substrate having high thermal conductivity

Production of resistor from insulating material by local heating

Method for manufacturing a hybrid integrated circuit device