Noburu Takeda

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method for laser processing of wafer
- Patent number 7,396,780
- Issue date Jul 8, 2008
- Disco Corporation
- Hitoshi Hoshino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Method for laser processing of wafer
- Publication number 20060094260
- Publication date May 4, 2006
- DISCO CORPORATION
- Hitoshi Hoshino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR