Nobutaka Shimizu

Person

Machida, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device, manufacturing method thereof, and electronic...
- Patent number 10,008,432
- Issue date Jun 26, 2018
- SOCIONEXT INC.
- Takumi Ihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having multiple bonded heat sinks
- Patent number 9,721,866
- Issue date Aug 1, 2017
- SOCIONEXT INC.
- Takeshi Imamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of semiconductor device
- Patent number 9,716,049
- Issue date Jul 25, 2017
- SOCIONEXT INC.
- Kazuyuki Urago
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor device having multiple hea...
- Patent number 9,224,711
- Issue date Dec 29, 2015
- SOCIONEXT INC.
- Takeshi Imamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 7,754,534
- Issue date Jul 13, 2010
- Fujitsu Semiconductor Limited
- Nobukatsu Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of a semiconductor device incorporating a pass...
- Patent number 6,995,044
- Issue date Feb 7, 2006
- Fujitsu Limited
- Yoshiyuki Yoneda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of a semiconductor device incorporating a pass...
- Patent number 6,875,638
- Issue date Apr 5, 2005
- Fujitsu Limited
- Yoshiyuki Yoneda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 6,794,273
- Issue date Sep 21, 2004
- Fujitsu Limited
- Nobukatsu Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip semiconductor device having an improved reliability
- Patent number 6,566,748
- Issue date May 20, 2003
- Fujitsu Limited
- Nobutaka Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having cap
- Patent number 6,239,486
- Issue date May 29, 2001
- Fujitsu Limited
- Nobutaka Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic package type semiconductor device and method of assembling...
- Patent number 5,081,067
- Issue date Jan 14, 1992
- Fujitsu Limited
- Nobutaka Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic package type semiconductor device and method of assembling...
- Patent number 5,055,914
- Issue date Oct 8, 1991
- Fujitsu Limited
- Nobutaka Shimizu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC...
- Publication number 20170047266
- Publication date Feb 16, 2017
- SOCIONEXT INC.
- Takumi Ihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE HAVING MULTIPLE HEA...
- Publication number 20160071782
- Publication date Mar 10, 2016
- SOCIONEXT INC.
- Takeshi Imamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20160035637
- Publication date Feb 4, 2016
- SOCIONEXT INC.
- Kazuyuki URAGO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20140197533
- Publication date Jul 17, 2014
- FUJITSU SEMICONDUCTOR LIMITED
- Takeshi Imamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20080261336
- Publication date Oct 23, 2008
- Fujitsu Limited
- Nobukatsu Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20040232549
- Publication date Nov 25, 2004
- FUJITSU LIMITED
- Nobukatsu Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing method of a semiconductor device incorporating a pass...
- Publication number 20040053444
- Publication date Mar 18, 2004
- FUJITSU LIMITED
- Yoshiyuki Yoneda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20030219969
- Publication date Nov 27, 2003
- FUJITSU LIMITED
- Nobukatsu Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing method of a semiconductor device incorporating a pass...
- Publication number 20030082846
- Publication date May 1, 2003
- FUJITSU LIMITED
- Yoshiyuki Yoneda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Nobutaka Shimizu

Person

Patents Grantslast 30 patents

Semiconductor device, manufacturing method thereof, and electronic...

Semiconductor device having multiple bonded heat sinks

Semiconductor device and manufacturing method of semiconductor device

Method for manufacturing a semiconductor device having multiple hea...

Semiconductor device and manufacturing method thereof

Manufacturing method of a semiconductor device incorporating a pass...

Manufacturing method of a semiconductor device incorporating a pass...

Semiconductor device and manufacturing method thereof

Flip-chip semiconductor device having an improved reliability

Semiconductor device having cap

Ceramic package type semiconductor device and method of assembling...

Ceramic package type semiconductor device and method of assembling...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC...

METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE HAVING MULTIPLE HEA...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR...

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Manufacturing method of a semiconductor device incorporating a pass...

Semiconductor device and manufacturing method thereof

Manufacturing method of a semiconductor device incorporating a pass...