TREA

Nobuto Yamazaki

Follow

Person

  • Tokyo, JP
People

Patents Grantslast 30 patents

  • Information Patent Grant

    Wire cutting and feeding device for use in wire bonding apparatus
    • Patent number 6,089,439
    • Issue date Jul 18, 2000
    • Kabushiki Kaisha Shinkawa
    • Nobuto Yamazaki
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wire bonding method
    • Patent number 6,080,651
    • Issue date Jun 27, 2000
    • Kabushiki Kaisha Shinkawa
    • Kuniyuki Takahashi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Bump forming method
    • Patent number 5,981,371
    • Issue date Nov 9, 1999
    • Kabushiki Kaisha Shinkawa
    • Nobuto Yamazaki
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Capillary for use in a wire bonding apparatus
    • Patent number 5,906,308
    • Issue date May 25, 1999
    • Kabushiki Kaisha Shinkawa
    • Nobuto Yamazaki
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Capillary for a wire bonding apparatus
    • Patent number 5,884,830
    • Issue date Mar 23, 1999
    • Kabushiki Kaisha Shinkawa
    • Nobuto Yamazaki
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Ball detection method and apparatus for wire-bonded parts
    • Patent number 5,870,489
    • Issue date Feb 9, 1999
    • Kabushiki Kaisha Shinkawa
    • Nobuto Yamazaki
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Non-contact type moving table
    • Patent number 5,562,395
    • Issue date Oct 8, 1996
    • Kabushiki Kaisha Shinkawa
    • Nobuto Yamazaki
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Non-contact type moving table
    • Patent number 5,562,396
    • Issue date Oct 8, 1996
    • Kabushiki Kaisha Shinkawa
    • Nobuto Yamazaki
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Non-contact type moving table
    • Patent number 5,501,569
    • Issue date Mar 26, 1996
    • Kabushiki Kaisha Shinkawa
    • Nobuto Yamazaki
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding apparatus
    • Patent number 5,486,733
    • Issue date Jan 23, 1996
    • Kabushiki Kaisha Shinkawa
    • Nobuto Yamazaki
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Method and apparatus for inspecting bent portions in wire loops
    • Patent number 5,485,398
    • Issue date Jan 16, 1996
    • Kabushiki Kaisha Shinkawa
    • Nobuto Yamazaki
    • G01 - MEASURING TESTING
  • Information Patent Grant

    Non-contact type moving table
    • Patent number 5,439,341
    • Issue date Aug 8, 1995
    • Kabushiki Kaisha Shinkawa
    • Nobuto Yamazaki
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Non-contact type moving table system
    • Patent number 5,431,527
    • Issue date Jul 11, 1995
    • Kabushiki Kaisha Shinkawa
    • Nobuto Yamazaki
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding apparatus
    • Patent number 5,411,195
    • Issue date May 2, 1995
    • Kabushiki Kaisha Shinkawa
    • Nobuto Yamazaki
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wire clamper
    • Patent number 5,323,948
    • Issue date Jun 28, 1994
    • Kabushiki Kaisha Shinkawa
    • Nobuto Yamazaki
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wire bonding method and apparatus
    • Patent number 5,297,722
    • Issue date Mar 29, 1994
    • Kabushiki Kaisha Shinkawa
    • Kuniyuki Takahashi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wire bonding apparatus
    • Patent number 5,275,324
    • Issue date Jan 4, 1994
    • Kabushiki Kaisha Shinkawa
    • Nobuto Yamazaki
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wire bonding method
    • Patent number 5,259,548
    • Issue date Nov 9, 1993
    • Kabushiki Kaisha Shinkawa
    • Nobuto Yamazaki
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method for bonding semiconductor elements to a tab tape
    • Patent number 5,223,063
    • Issue date Jun 29, 1993
    • Kabushiki Kaisha Shinkawa
    • Nobuto Yamazaki
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wire bonding method and apparatus with lead pressing means
    • Patent number 5,197,652
    • Issue date Mar 30, 1993
    • Kabushiki Kaisha Shinkawa
    • Nobuto Yamazaki
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wire bonding method
    • Patent number 5,192,018
    • Issue date Mar 9, 1993
    • Kabushiki Kaisha Shinkawa
    • Yoshimitsu Terakado
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    X-Y table for bonding devices
    • Patent number 5,157,985
    • Issue date Oct 27, 1992
    • Kabushiki Kaisha Shinkawa
    • Nobuto Yamazaki
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wire bonding method
    • Patent number 5,156,323
    • Issue date Oct 20, 1992
    • Kabushiki Kaisha Shinkawa
    • Shinichi Kumazawa
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wire bonding method
    • Patent number 5,137,201
    • Issue date Aug 11, 1992
    • Kabushiki Kaisha Shinkawa
    • Nobuto Yamazaki
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wire bonding method
    • Patent number 5,123,585
    • Issue date Jun 23, 1992
    • Kabushiki Kaisha Shinkawa
    • Yoshimitsu Terakado
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bump attachment method
    • Patent number 5,106,011
    • Issue date Apr 21, 1992
    • Kabushiki Kaisha Shinkawa
    • Nobuto Yamazaki
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wire bonding method
    • Patent number 5,078,312
    • Issue date Jan 7, 1992
    • Kabushiki Kaisha Shinkawa
    • Yuji Ohashi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Detection method for wire bonding failures
    • Patent number 5,058,797
    • Issue date Oct 22, 1991
    • Kabushiki Kaisha Shinkawa
    • Yoshimitsu Terakado
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Method for forming bump on semiconductor elements
    • Patent number 5,058,798
    • Issue date Oct 22, 1991
    • Kabushiki Kaisha Shinkawa
    • Nobuto Yamazaki
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method for manufacturing semiconductor elements equipped with leads
    • Patent number 5,056,217
    • Issue date Oct 15, 1991
    • Kabushiki Kaisha Shinkawa
    • Nobuto Yamazaki
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    Image processing method and device
    • Publication number 20020102016
    • Publication date Aug 1, 2002
    • KABUSHIKI KAISHA SHINKAWA
    • Nobuto Yamazaki
    • G06 - COMPUTING CALCULATING COUNTING