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Nobutoshi Saito

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  • Tokyo, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Plating apparatus and plating method
    • Patent number RE45687
    • Issue date Sep 29, 2015
    • Ebara Corporation
    • Nobutoshi Saito
    • 001 -
  • Information Patent Grant

    Plating apparatus and plating method
    • Patent number 8,784,636
    • Issue date Jul 22, 2014
    • Ebara Corporation
    • Mizuki Nagai
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Plating apparatus and plating method
    • Patent number 8,486,234
    • Issue date Jul 16, 2013
    • Ebara Corporation
    • Nobutoshi Saito
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Plating method and apparatus
    • Patent number 8,317,993
    • Issue date Nov 27, 2012
    • Ebara Corporation
    • Fumio Kuriyama
    • B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
  • Information Patent Grant

    Plating apparatus
    • Patent number 8,252,167
    • Issue date Aug 28, 2012
    • Ebara Corporation
    • Fumio Kuriyama
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Plating apparatus and plating method
    • Patent number 8,177,944
    • Issue date May 15, 2012
    • Ebara Corporation
    • Nobutoshi Saito
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Plating apparatus and method
    • Patent number 8,012,332
    • Issue date Sep 6, 2011
    • Ebara Corporation
    • Junichiro Yoshioka
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Plating apparatus
    • Patent number 7,875,158
    • Issue date Jan 25, 2011
    • Ebara Corporation
    • Fumio Kuriyama
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Plating apparatus and method
    • Patent number 7,402,227
    • Issue date Jul 22, 2008
    • Ebara Corporation
    • Junichiro Yoshioka
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Plating method and apparatus
    • Patent number 7,118,664
    • Issue date Oct 10, 2006
    • Ebara Corporation
    • Junichiro Yoshioka
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Lead free bump and method of forming the same
    • Patent number 7,012,333
    • Issue date Mar 14, 2006
    • Ebara Corporation
    • Masashi Shimoyama
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Plating method and apparatus
    • Patent number 6,716,332
    • Issue date Apr 6, 2004
    • Ebara Corporation
    • Junichiro Yoshioka
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

  • Information Patent Application

    METHOD FOR FORMING CONDUCTIVE STRUCTURE, AND PLATING APPARATUS AND...
    • Publication number 20140287580
    • Publication date Sep 25, 2014
    • Mizuki Nagai
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PLATING APPARATUS AND PLATING METHOD
    • Publication number 20130015075
    • Publication date Jan 17, 2013
    • Masahiko SEKIMOTO
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PLATING APPARATUS AND PLATING METHOD
    • Publication number 20120193220
    • Publication date Aug 2, 2012
    • Nobutoshi Saito
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    ELECTROPLATING METHOD
    • Publication number 20120160696
    • Publication date Jun 28, 2012
    • Yuji ARAKI
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PLATING APPARATUS
    • Publication number 20110073482
    • Publication date Mar 31, 2011
    • Fumio Kuriyama
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Plating method and apparatus
    • Publication number 20090311429
    • Publication date Dec 17, 2009
    • Fumio Kuriyama
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PLATING APPARATUS AND PLATING METHOD
    • Publication number 20090301395
    • Publication date Dec 10, 2009
    • Masahiko SEKIMOTO
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Plating apparatus
    • Publication number 20090218231
    • Publication date Sep 3, 2009
    • Toshikazu Yajima
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Plating apparatus and plating method
    • Publication number 20090139870
    • Publication date Jun 4, 2009
    • Mizuki Nagai
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Plating apparatus and plating method
    • Publication number 20090139871
    • Publication date Jun 4, 2009
    • Nobutoshi Saito
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PLATING APPARATUS AND METHOD
    • Publication number 20080245669
    • Publication date Oct 9, 2008
    • Junichiro Yoshioka
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Plating method and apparatus
    • Publication number 20070117365
    • Publication date May 24, 2007
    • EBARA CORPORATION
    • Fumio Kuriyama
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Plating apparatus and plating method
    • Publication number 20060141157
    • Publication date Jun 29, 2006
    • Masahiko Sekimoto
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Plating apparatus
    • Publication number 20060113185
    • Publication date Jun 1, 2006
    • Fumio Kuriyama
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Plating apparatus and plating method
    • Publication number 20060081478
    • Publication date Apr 20, 2006
    • Tsuyoshi Sahoda
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Method of forming a lead-free bump and a plating apparatus therefor
    • Publication number 20050279640
    • Publication date Dec 22, 2005
    • Masashi Shimoyama
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Plating apparatus and method
    • Publication number 20050082163
    • Publication date Apr 21, 2005
    • Junichiro Yoshioka
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Plating device
    • Publication number 20040262150
    • Publication date Dec 30, 2004
    • Toshikazu Yajima
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Lead free bump and method of forming the same
    • Publication number 20040219775
    • Publication date Nov 4, 2004
    • Masashi Shimoyama
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Plating method and apparatus
    • Publication number 20040159550
    • Publication date Aug 19, 2004
    • Junichiro Yoshioka
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Plating apparatus and method
    • Publication number 20020027080
    • Publication date Mar 7, 2002
    • Junichiro Yoshioka
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR