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Nobuya Makino
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Anjo-city, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Packaging method
Patent number
7,470,996
Issue date
Dec 30, 2008
Denso Corporation
Takao Yoneyama
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Substrate package structure and packaging method thereof
Patent number
7,405,478
Issue date
Jul 29, 2008
Denso Corporation
Katsumi Ishikawa
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Wire bonding method and semiconductor device
Patent number
7,285,854
Issue date
Oct 23, 2007
Denso Corporation
Katsumi Ishikawa
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
Packaging method
Publication number
20070023483
Publication date
Feb 1, 2007
DENSO CORPORATION
Takao Yoneyama
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Substrate package structure and packaging method thereof
Publication number
20060113668
Publication date
Jun 1, 2006
DENSO CORPORATION
Katsumi Ishikawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Wire bonding method and semiconductor device
Publication number
20050205995
Publication date
Sep 22, 2005
DENSO Corporation
Katsumi Ishikawa
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR