Nobuya Takahashi

Person

Ogaki-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Printed wiring board
- Patent number 9,736,945
- Issue date Aug 15, 2017
- Ibiden Co., Ltd.
- Nobuya Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 9,711,439
- Issue date Jul 18, 2017
- Ibiden Co., Ltd.
- Hajime Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component having encapsulated wiring board and method fo...
- Patent number 9,536,801
- Issue date Jan 3, 2017
- Ibiden Co., Ltd.
- Toshiki Furutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 9,480,157
- Issue date Oct 25, 2016
- Ibiden Co., Ltd.
- Yoshinori Shizuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for mounting semiconductor, semiconductor device and meth...
- Patent number 9,338,886
- Issue date May 10, 2016
- Ibiden Co., Ltd.
- Toshiki Furutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component having encapsulated wiring board and method fo...
- Patent number 9,059,187
- Issue date Jun 16, 2015
- Ibiden Co., Ltd.
- Toshiki Furutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 9,035,463
- Issue date May 19, 2015
- Ibiden Co., Ltd.
- Yoshinori Shizuno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate for mounting semiconductor, semiconductor device and meth...
- Patent number 8,785,255
- Issue date Jul 22, 2014
- Ibiden Co., Ltd.
- Toshiki Furutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate for mounting semiconductor, semiconductor device and meth...
- Patent number 8,698,303
- Issue date Apr 15, 2014
- Ibiden Co., Ltd.
- Toshiki Furutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board
- Patent number 8,546,922
- Issue date Oct 1, 2013
- Ibiden Co., Ltd.
- Toshiki Furutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160066423
- Publication date Mar 3, 2016
- IBIDEN CO., LTD.
- Hajime SAKAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20160037629
- Publication date Feb 4, 2016
- IBIDEN CO., LTD.
- Nobuya TAKAHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT HAVING ENCAPSULATED WIRING BOARD AND METHOD FO...
- Publication number 20150255359
- Publication date Sep 10, 2015
- IBIDEN CO., LTD.
- Toshiki FURUTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20150245485
- Publication date Aug 27, 2015
- IBIDEN CO., LTD.
- Nobuya TAKAHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150216049
- Publication date Jul 30, 2015
- IBIDEN CO., LTD.
- Yoshinori SHIZUNO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE FOR MOUNTING SEMICONDUCTOR, SEMICONDUCTOR DEVICE AND METH...
- Publication number 20140284820
- Publication date Sep 25, 2014
- IBIDEN CO., LTD.
- Toshiki FURUTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR MOUNTING SEMICONDUCTOR, SEMICONDUCTOR DEVICE AND METH...
- Publication number 20140162411
- Publication date Jun 12, 2014
- IBIDEN CO., LTD.
- Toshiki FURUTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130307162
- Publication date Nov 21, 2013
- IBIDEN CO., LTD.
- Yoshinori Shizuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR MOUNTING SEMICONDUCTOR, SEMICONDUCTOR DEVICE AND METH...
- Publication number 20120181708
- Publication date Jul 19, 2012
- IBIDEN CO., LTD.
- Toshiki FURUTANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20120175754
- Publication date Jul 12, 2012
- IBIDEN CO., LTD.
- Toshiki FURUTANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20120080786
- Publication date Apr 5, 2012
- IBIDEN CO., LTD.
- Toshiki FURUTANI
- H01 - BASIC ELECTRIC ELEMENTS

Nobuya Takahashi

Person

Patents Grantslast 30 patents

Printed wiring board

Printed wiring board and method for manufacturing the same

Electronic component having encapsulated wiring board and method fo...

Wiring board and method for manufacturing the same

Substrate for mounting semiconductor, semiconductor device and meth...

Electronic component having encapsulated wiring board and method fo...

Wiring board and method for manufacturing the same

Substrate for mounting semiconductor, semiconductor device and meth...

Substrate for mounting semiconductor, semiconductor device and meth...

Wiring board

Patents Applicationslast 30 patents

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

PRINTED WIRING BOARD

ELECTRONIC COMPONENT HAVING ENCAPSULATED WIRING BOARD AND METHOD FO...

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

SUBSTRATE FOR MOUNTING SEMICONDUCTOR, SEMICONDUCTOR DEVICE AND METH...

SUBSTRATE FOR MOUNTING SEMICONDUCTOR, SEMICONDUCTOR DEVICE AND METH...

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

SUBSTRATE FOR MOUNTING SEMICONDUCTOR, SEMICONDUCTOR DEVICE AND METH...

WIRING BOARD

ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME