Nobuyasu Kitahara

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Protective film thickness measuring method
- Patent number 11,892,282
- Issue date Feb 6, 2024
- Disco Corporation
- Hiroto Yoshida
- G01 - MEASURING TESTING
Information Patent Grant
Processing method of workpiece
- Patent number 11,133,186
- Issue date Sep 28, 2021
- Disco Corporation
- Nobuyasu Kitahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Jig and processing method using jig
- Patent number 10,201,936
- Issue date Feb 12, 2019
- Disco Corporation
- Nobuyasu Kitahara
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Ablation method for die attach film
- Patent number 9,700,961
- Issue date Jul 11, 2017
- Disco Corporation
- Nobuyasu Kitahara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Protective film agent for laser dicing and wafer processing method...
- Patent number 9,090,783
- Issue date Jul 28, 2015
- TOKYO OHKA KOGYO CO., LTD.
- Hiroshi Takanashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer processing method
- Patent number 9,054,179
- Issue date Jun 9, 2015
- Disco Corporation
- Chikara Aikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective film forming method and apparatus
- Patent number 8,461,025
- Issue date Jun 11, 2013
- Disco Corporation
- Nobuyasu Kitahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method for device having die attach film on the back si...
- Patent number 7,915,140
- Issue date Mar 29, 2011
- Disco Corporation
- Satoshi Genda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for applying resin film to face of semiconductor wafer
- Patent number 7,799,700
- Issue date Sep 21, 2010
- Disco Corporation
- Kentaro Iizuka
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for breaking adhesive film mounted on back of wafer
- Patent number 7,696,014
- Issue date Apr 13, 2010
- Disco Corporation
- Nobuyasu Kitahara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer laser processing method
- Patent number 7,446,022
- Issue date Nov 4, 2008
- Disco Corporation
- Toshiyuki Yoshikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for laser processing of wafer
- Patent number 7,396,780
- Issue date Jul 8, 2008
- Disco Corporation
- Hitoshi Hoshino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer processing method
- Patent number 7,179,723
- Issue date Feb 20, 2007
- Disco Corporation
- Satoshi Genda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING LAMINATED DEVICE CHIPS
- Publication number 20240079261
- Publication date Mar 7, 2024
- Disco Corporation
- Zhiwen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING APPARATUS AND VIBRATION DETECTING METHOD
- Publication number 20230041754
- Publication date Feb 9, 2023
- Disco Corporation
- Hiroto YOSHIDA
- G01 - MEASURING TESTING
Information Patent Application
MANUFACTURING METHOD FOR DEVICE CHIP
- Publication number 20220399235
- Publication date Dec 15, 2022
- Disco Corporation
- Katsuhiko SUZUKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROTECTIVE FILM THICKNESS MEASURING METHOD
- Publication number 20220373321
- Publication date Nov 24, 2022
- Disco Corporation
- Hiroto YOSHIDA
- G01 - MEASURING TESTING
Information Patent Application
PROCESSING METHOD OF WORKPIECE
- Publication number 20200090934
- Publication date Mar 19, 2020
- Disco Corporation
- Nobuyasu KITAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JIG AND PROCESSING METHOD USING JIG
- Publication number 20170210060
- Publication date Jul 27, 2017
- Disco Corporation
- Nobuyasu Kitahara
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20150104930
- Publication date Apr 16, 2015
- Disco Corporation
- Chikara Aikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20140206177
- Publication date Jul 24, 2014
- Disco Corporation
- Yuki Ogawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER PROCESSING METHOD AND FINE PARTICLE LAYER FORMING AGENT
- Publication number 20140175070
- Publication date Jun 26, 2014
- Disco Corporation
- Yukinobu Ohura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ABLATION METHOD FOR SUBSTRATE ON WHICH PASSIVATION FILM IS FORMED
- Publication number 20130087948
- Publication date Apr 11, 2013
- Disco Corporation
- Nobuyasu KITAHARA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ABLATION METHOD
- Publication number 20130087947
- Publication date Apr 11, 2013
- Disco Corporation
- Nobuyasu KITAHARA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ABLATION METHOD FOR DIE ATTACH FILM
- Publication number 20130087949
- Publication date Apr 11, 2013
- Disco Corporation
- Nobuyasu KITAHARA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROTECTIVE FILM FORMING METHOD AND APPARATUS
- Publication number 20110059620
- Publication date Mar 10, 2011
- Disco Corporation
- Nobuyasu Kitahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTIVE FILM AGENT FOR LASER DICING AND WAFER PROCESSING METHOD...
- Publication number 20100304551
- Publication date Dec 2, 2010
- Tokyo Ohka Kogyo Co., Ltd.
- Hiroshi Takanashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROTECTIVE FILM FORMING METHOD AND APPARATUS
- Publication number 20100129546
- Publication date May 27, 2010
- Disco Corporation
- Nobuyasu Kitahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD FOR DEVICE HAVING DIE ATTACH FILM ON THE BACK SI...
- Publication number 20090280622
- Publication date Nov 12, 2009
- Disco Corporation
- Satoshi Genda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BREAKING ADHESIVE FILM MOUNTED ON BACK OF WAFER
- Publication number 20090215246
- Publication date Aug 27, 2009
- Disco Corporation
- Nobuyasu KITAHARA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for applying resin film to face of semiconductor wafer
- Publication number 20070054498
- Publication date Mar 8, 2007
- DISCO CORPORATION
- Kentaro Iizuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer laser processing method
- Publication number 20060216911
- Publication date Sep 28, 2006
- DISCO CORPORATION
- Toshiyuki Yoshikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Protective film agent for laser dicing and wafer processing method...
- Publication number 20060105544
- Publication date May 18, 2006
- Tokyo Ohka Kogyo Co., Ltd.
- Hiroshi Takanashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for laser processing of wafer
- Publication number 20060094260
- Publication date May 4, 2006
- DISCO CORPORATION
- Hitoshi Hoshino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Laser processing method
- Publication number 20060035411
- Publication date Feb 16, 2006
- DISCO CORPORATION
- Ryugo Oba
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wafer processing method
- Publication number 20050106782
- Publication date May 19, 2005
- Satoshi Genda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Nobuyasu Kitahara

Person

Patents Grantslast 30 patents

Protective film thickness measuring method

Processing method of workpiece

Jig and processing method using jig

Ablation method for die attach film

Protective film agent for laser dicing and wafer processing method...

Wafer processing method

Protective film forming method and apparatus

Fabrication method for device having die attach film on the back si...

Method for applying resin film to face of semiconductor wafer

Method for breaking adhesive film mounted on back of wafer

Wafer laser processing method

Method for laser processing of wafer

Wafer processing method

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING LAMINATED DEVICE CHIPS

PROCESSING APPARATUS AND VIBRATION DETECTING METHOD

MANUFACTURING METHOD FOR DEVICE CHIP

PROTECTIVE FILM THICKNESS MEASURING METHOD

PROCESSING METHOD OF WORKPIECE

JIG AND PROCESSING METHOD USING JIG

WAFER PROCESSING METHOD

WAFER PROCESSING METHOD

LASER PROCESSING METHOD AND FINE PARTICLE LAYER FORMING AGENT

ABLATION METHOD FOR SUBSTRATE ON WHICH PASSIVATION FILM IS FORMED

ABLATION METHOD

ABLATION METHOD FOR DIE ATTACH FILM

PROTECTIVE FILM FORMING METHOD AND APPARATUS

PROTECTIVE FILM AGENT FOR LASER DICING AND WAFER PROCESSING METHOD...

PROTECTIVE FILM FORMING METHOD AND APPARATUS

FABRICATION METHOD FOR DEVICE HAVING DIE ATTACH FILM ON THE BACK SI...

METHOD FOR BREAKING ADHESIVE FILM MOUNTED ON BACK OF WAFER

Method for applying resin film to face of semiconductor wafer

Wafer laser processing method

Protective film agent for laser dicing and wafer processing method...

Method for laser processing of wafer

Laser processing method

Wafer processing method