Nobuyuki Ikarashi

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of manufacturing the semiconductor...
- Patent number 9,362,110
- Issue date Jun 7, 2016
- Renesas Electronics Corporation
- Nobuyuki Ikarashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, semiconductor substrate, method for manufactu...
- Patent number 9,263,532
- Issue date Feb 16, 2016
- Renesas Electronics Corporation
- Nobuyuki Ikarashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, semiconductor substrate, method for manufactu...
- Patent number 8,975,728
- Issue date Mar 10, 2015
- Renesas Electronics Corporation
- Nobuyuki Ikarashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the semiconductor...
- Patent number 8,872,234
- Issue date Oct 28, 2014
- Renesas Electronics Corporation
- Nobuyuki Ikarashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor, semiconductor device having the same, and method of prod...
- Patent number 8,368,175
- Issue date Feb 5, 2013
- NEC Corporation
- Takashi Nakagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric, capacitor using dielectric, semiconductor device using...
- Patent number 8,203,176
- Issue date Jun 19, 2012
- Renesas Electronics Corporation
- Takashi Nakagawa
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Formation method of metallic compound layer, manufacturing method o...
- Patent number 7,968,463
- Issue date Jun 28, 2011
- Renesas Electronics Corporation
- Takashi Nakagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 7,812,412
- Issue date Oct 12, 2010
- NEC Corporation
- Kouji Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with silicide-containing gate electrode and me...
- Patent number 7,592,674
- Issue date Sep 22, 2009
- NEC Corporation
- Kensuke Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper alloy for wiring, semiconductor device, method for forming w...
- Patent number 7,545,040
- Issue date Jun 9, 2009
- NEC Corporation
- Makoto Ueki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with high dielectric constant insulating film...
- Patent number 7,495,264
- Issue date Feb 24, 2009
- NEC Corporation
- Heiji Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a mis-type fet, and methods for manufac...
- Patent number 7,476,916
- Issue date Jan 13, 2009
- NEC Corporation
- Toru Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having high-permittivity insulation film and p...
- Patent number 7,164,169
- Issue date Jan 16, 2007
- NEC Corporation
- Heiji Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a MIS transistor
- Patent number 6,459,126
- Issue date Oct 1, 2002
- NEC Corporation
- Tohru Mogami
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR MEMORY DEVICE, AND METHOD FOR PRODUCING THE SAME
- Publication number 20160005792
- Publication date Jan 7, 2016
- RENESAS ELECTRONICS CORPORATION
- Makoto UEKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device, Semiconductor Substrate, Method for Manufactu...
- Publication number 20150179746
- Publication date Jun 25, 2015
- RENESAS ELECTRONICS CORPORATION
- Nobuyuki Ikarashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150014682
- Publication date Jan 15, 2015
- RENESAS ELECTRONICS CORPORATION
- Nobuyuki Ikarashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20140363982
- Publication date Dec 11, 2014
- Renesas Electronics Corporation
- Nobuyuki IKARASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20130168690
- Publication date Jul 4, 2013
- RENESAS ELECTRONICS CORPORATION
- Nobuyuki IKARASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR SUBSTRATE, METHOD FOR MANUFACTU...
- Publication number 20130092949
- Publication date Apr 18, 2013
- Renesas Electronics Corporation
- Nobuyuki Ikarashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE
- Publication number 20120104614
- Publication date May 3, 2012
- RENESAS ELECTRONICS CORPORATION
- Nobuyuki IKARASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER ALLOY FOR WIRING, SEMICONDUCTOR DEVICE, METHOD FOR FORMING W...
- Publication number 20120061844
- Publication date Mar 15, 2012
- NEC Corporation
- Makoto Ueki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CRYSTAL PHASE STABILIZING STRUCTURE
- Publication number 20110193145
- Publication date Aug 11, 2011
- RENESAS ELECTRONICS CORPORATION
- Nobuyuki IKARASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR, SEMICONDUCTOR DEVICE COMPRISING THE SAME, METHOD FOR MAN...
- Publication number 20110018100
- Publication date Jan 27, 2011
- Takashi Nakagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC, CAPACITOR USING DIELECTRIC, SEMICONDUCTOR DEVICE USING...
- Publication number 20100320520
- Publication date Dec 23, 2010
- Takashi Nakagawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MOSFET, METHOD OF FABRICATING THE SAME, CMOSFET, AND METHOD OF FABR...
- Publication number 20100219478
- Publication date Sep 2, 2010
- NEC Corporation
- Kenzo Manabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device
- Publication number 20090267163
- Publication date Oct 29, 2009
- Kouji Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER ALLOY FOR WIRING, SEMICONDUCTOR DEVICE, METHOD FOR FORMING W...
- Publication number 20090203208
- Publication date Aug 13, 2009
- NEC Corporation
- Makoto Ueki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Formation method of metallic compound layer, manufacturing method o...
- Publication number 20090170252
- Publication date Jul 2, 2009
- Takashi Nakagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and production method therefor
- Publication number 20080203500
- Publication date Aug 28, 2008
- NEC Corporation
- Takashi Ogura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of fabricating the same
- Publication number 20070138580
- Publication date Jun 21, 2007
- NEC Corporation
- Kensuke Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having a mis-type fet, and methods for manufac...
- Publication number 20070096104
- Publication date May 3, 2007
- NEC Corporation
- Toru Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH HIGH DIELECTRIC CONSTANT INSULATING FILM...
- Publication number 20070090450
- Publication date Apr 26, 2007
- NEC Corporation
- Heiji Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and production method therefor
- Publication number 20060131670
- Publication date Jun 22, 2006
- Takashi Ogura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper alloy for wiring, semiconductor device, method for forming w...
- Publication number 20060113685
- Publication date Jun 1, 2006
- NEC Corporation
- Makoto Ueki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having high-piemittivity insulation film and p...
- Publication number 20040171276
- Publication date Sep 2, 2004
- Heiji Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device including a MIS transistor
- Publication number 20020096721
- Publication date Jul 25, 2002
- NEC Corporation
- Tohru Mogami
- H01 - BASIC ELECTRIC ELEMENTS

Nobuyuki Ikarashi

Person

Patents Grantslast 30 patents

Semiconductor device and method of manufacturing the semiconductor...

Semiconductor device, semiconductor substrate, method for manufactu...

Semiconductor device, semiconductor substrate, method for manufactu...

Semiconductor device and method of manufacturing the semiconductor...

Capacitor, semiconductor device having the same, and method of prod...

Dielectric, capacitor using dielectric, semiconductor device using...

Formation method of metallic compound layer, manufacturing method o...

Semiconductor device

Semiconductor device with silicide-containing gate electrode and me...

Copper alloy for wiring, semiconductor device, method for forming w...

Semiconductor device with high dielectric constant insulating film...

Semiconductor device having a mis-type fet, and methods for manufac...

Semiconductor device having high-permittivity insulation film and p...

Semiconductor device including a MIS transistor

Patents Applicationslast 30 patents

SEMICONDUCTOR MEMORY DEVICE, AND METHOD FOR PRODUCING THE SAME

Semiconductor Device, Semiconductor Substrate, Method for Manufactu...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR DEVICE, SEMICONDUCTOR SUBSTRATE, METHOD FOR MANUFACTU...

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE

COPPER ALLOY FOR WIRING, SEMICONDUCTOR DEVICE, METHOD FOR FORMING W...

CRYSTAL PHASE STABILIZING STRUCTURE

CAPACITOR, SEMICONDUCTOR DEVICE COMPRISING THE SAME, METHOD FOR MAN...

DIELECTRIC, CAPACITOR USING DIELECTRIC, SEMICONDUCTOR DEVICE USING...

MOSFET, METHOD OF FABRICATING THE SAME, CMOSFET, AND METHOD OF FABR...

Semiconductor Device

COPPER ALLOY FOR WIRING, SEMICONDUCTOR DEVICE, METHOD FOR FORMING W...

Formation method of metallic compound layer, manufacturing method o...

Semiconductor device and production method therefor

Semiconductor device and method of fabricating the same

Semiconductor device having a mis-type fet, and methods for manufac...

SEMICONDUCTOR DEVICE WITH HIGH DIELECTRIC CONSTANT INSULATING FILM...

Semiconductor device and production method therefor

Copper alloy for wiring, semiconductor device, method for forming w...

Semiconductor device having high-piemittivity insulation film and p...

Semiconductor device including a MIS transistor