Nobuyuki Ikeguchi

Person

Suwon-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing and insulating sheet
- Patent number 8,997,340
- Issue date Apr 7, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Keungjin Sohn
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of fabricating semiconductor plastic package including a cor...
- Patent number 8,647,926
- Issue date Feb 11, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Joon-Sik Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor package having a first board,...
- Patent number 8,174,128
- Issue date May 8, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Nobuyuki Ikeguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor package and semiconductor pla...
- Patent number 8,030,752
- Issue date Oct 4, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Nobuyuki Ikeguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor plastic package and fabricating method thereof
- Patent number 7,893,527
- Issue date Feb 22, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Joon-Sik Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FABRICATING MULTILAYERED PRINTED CIRCUIT BOARD
- Publication number 20120174393
- Publication date Jul 12, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Nobuyuki Ikeguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing insulating sheet and printed circuit board...
- Publication number 20120012247
- Publication date Jan 19, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Keungjin Sohn
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Method of fabricating semiconductor plastic package
- Publication number 20100330747
- Publication date Dec 30, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Joon-Sik Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing semiconductor package
- Publication number 20100291737
- Publication date Nov 18, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Nobuyuki Ikeguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Insulating sheet and printed circuit board having the same
- Publication number 20090242248
- Publication date Oct 1, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Keungjin Sohn
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Method for manufacturing insulating sheet and method for manufactur...
- Publication number 20090236038
- Publication date Sep 24, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Nobuyuki Ikeguchi
- B32 - LAYERED PRODUCTS
Information Patent Application
Printed circuit board and manufacturing method thereof
- Publication number 20090159318
- Publication date Jun 25, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Nobuyuki Ikeguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing semiconductor package and semiconductor pla...
- Publication number 20090152742
- Publication date Jun 18, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Nobuyuki Ikeguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayered printed circuit board and fabricating method thereof
- Publication number 20090008136
- Publication date Jan 8, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Nobuyuki Ikeguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Nobuyuki Ikeguchi

Person

Patents Grantslast 30 patents

Method of manufacturing and insulating sheet

Method of fabricating semiconductor plastic package including a cor...

Method of manufacturing semiconductor package having a first board,...

Method of manufacturing semiconductor package and semiconductor pla...

Semiconductor plastic package and fabricating method thereof

Patents Applicationslast 30 patents

METHOD OF FABRICATING MULTILAYERED PRINTED CIRCUIT BOARD

Method of manufacturing insulating sheet and printed circuit board...

Method of fabricating semiconductor plastic package

Method of manufacturing semiconductor package

Insulating sheet and printed circuit board having the same

Method for manufacturing insulating sheet and method for manufactur...

Printed circuit board and manufacturing method thereof

Method of manufacturing semiconductor package and semiconductor pla...

Multilayered printed circuit board and fabricating method thereof