Nobuyuki Iwano

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Niigata, JP

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Patents Grantslast 30 patents

Information Patent Grant
Low-dielectric resin composition
- Patent number 10,982,093
- Issue date Apr 20, 2021
- Arisawa Mfg. Co., Ltd.
- Kazuo Yoshikawa
- B32 - LAYERED PRODUCTS
Information Patent Grant
Composition for polyimide resin, and polyimide resin made of the co...
- Patent number 8,426,503
- Issue date Apr 23, 2013
- Arisawa Mfg. Co., Ltd.
- Hiroyuki Matsuyama
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
RESIN COMPOSITION, ADHESIVE FILM, COVERLAY FILM, LAMINATE, RESIN-CO...
- Publication number 20180242448
- Publication date Aug 23, 2018
- Arisawa Mfg. Co., Ltd.
- Kazuo YOSHIKAWA
- B32 - LAYERED PRODUCTS
Information Patent Application
LOW-DIELECTRIC RESIN COMPOSITION
- Publication number 20180022919
- Publication date Jan 25, 2018
- Arisawa Mfg. Co., Ltd.
- Kazuo YOSHIKAWA
- B32 - LAYERED PRODUCTS
Information Patent Application
ADHESIVE RESIN COMPOSITION
- Publication number 20160280979
- Publication date Sep 29, 2016
- Arisawa Mfg. Co., Ltd.
- Akira Uchiyama
- B32 - LAYERED PRODUCTS
Information Patent Application
Resin Composition for Flexible Printed Circuit Board
- Publication number 20130316170
- Publication date Nov 28, 2013
- Arisawa Mfg. Co., Ltd.
- Akira Uchiyama
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Composition for Polyimide Resin, and Polyimide Resin Made of the Co...
- Publication number 20110303438
- Publication date Dec 15, 2011
- Arisawa Mfg. Co., Ltd.
- Hiroyuki Matsuyama
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...