Nobuyuki Iwashita

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Fukuoka, JP

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Patents Grantslast 30 patents

Information Patent Grant
Paste applicator and paste application method for die bonding
- Patent number 6,685,777
- Issue date Feb 3, 2004
- Matsushita Electric Industrial Co., Ltd.
- Seiichi Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding paste applicator and method of using it
- Patent number 6,605,315
- Issue date Aug 12, 2003
- Matsushita Electric Industrial Co., Ltd.
- Mitsuru Ozono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Paste application method for die bonding
- Patent number 6,361,831
- Issue date Mar 26, 2002
- Matsushita Electric Industrial Co., Ltd.
- Seiichi Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Paste applying method
- Patent number 6,348,234
- Issue date Feb 19, 2002
- Matsushita Electric Industrial Co., Ltd.
- Mitsuru Ozono
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Paste applicator and paste application method for die bonding
- Publication number 20020037372
- Publication date Mar 28, 2002
- Seiichi Sato
- H01 - BASIC ELECTRIC ELEMENTS