Nobuyuki Kato

Person

Seto, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 10,256,640
- Issue date Apr 9, 2019
- Denso Corporation
- Nobuyuki Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 8,728,923
- Issue date May 20, 2014
- Denso Corporation
- Jun Kawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method of manufacturing the same
- Patent number 8,598,458
- Issue date Dec 3, 2013
- Denso Corporation
- Hiroshi Ishino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
SiC semiconductor device having bottom layer and method for manufac...
- Patent number 7,851,854
- Issue date Dec 14, 2010
- Denso Corporation
- Eiichi Okuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing mold type semiconductor device
- Patent number 7,468,318
- Issue date Dec 23, 2008
- Denso Corporation
- Naohiko Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having heat radiation plate and bonding member
- Patent number 7,239,016
- Issue date Jul 3, 2007
- Denso Corporation
- Naohiko Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mold type semiconductor device
- Patent number 7,193,326
- Issue date Mar 20, 2007
- Denso Corporation
- Naohiko Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor physical quantity sensor and production method thereof
- Patent number 6,240,782
- Issue date Jun 5, 2001
- Denso Corporation
- Nobuyuki Kato
- G01 - MEASURING TESTING
Information Patent Grant
Method of manufacturing dynamic amount semiconductor sensor
- Patent number 6,048,774
- Issue date Apr 11, 2000
- Denso Corporation
- Toshimasa Yamamoto
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor sensor having suspended thin-film structure and metho...
- Patent number 5,922,212
- Issue date Jul 13, 1999
- Nippondenso Co., Ltd.
- Kazuhiko Kano
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240203811
- Publication date Jun 20, 2024
- Denso Corporation
- NOBUYUKI KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180145513
- Publication date May 24, 2018
- Denso Corporation
- Nobuyuki KATO
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20130102127
- Publication date Apr 25, 2013
- DENSO CORPORATION
- Jun KAWAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SILICON CARBIDE SEMICONDUCTOR DEVICE
- Publication number 20110306188
- Publication date Dec 15, 2011
- DENSO CORPORATION
- Jun KAWAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110192630
- Publication date Aug 11, 2011
- DENSO CORPORATION
- Hiroshi Ishino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SiC semiconductor device having bottom layer and method for manufac...
- Publication number 20090166730
- Publication date Jul 2, 2009
- DENSO CORPORATION
- Eiichi Okuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing mold type semiconductor device
- Publication number 20070158850
- Publication date Jul 12, 2007
- DENSO CORPORATION
- Naohiko Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor equipment having a pair of heat radiation plates
- Publication number 20060055056
- Publication date Mar 16, 2006
- DENSO Corporation
- Shoji Miura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having heat radiation plate and bonding member
- Publication number 20050077617
- Publication date Apr 14, 2005
- DENSO Corporation
- Naohiko Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mold type semiconductor device and method for manufacturing the same
- Publication number 20040256730
- Publication date Dec 23, 2004
- Naohiko Hirano
- H01 - BASIC ELECTRIC ELEMENTS

Nobuyuki Kato

Person

Patents Grantslast 30 patents

Semiconductor device

Manufacturing method of semiconductor device

Electronic device and method of manufacturing the same

SiC semiconductor device having bottom layer and method for manufac...

Method for manufacturing mold type semiconductor device

Semiconductor device having heat radiation plate and bonding member

Mold type semiconductor device

Semiconductor physical quantity sensor and production method thereof

Method of manufacturing dynamic amount semiconductor sensor

Semiconductor sensor having suspended thin-film structure and metho...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

MANUFACTURING METHOD OF SILICON CARBIDE SEMICONDUCTOR DEVICE

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

SiC semiconductor device having bottom layer and method for manufac...

Method for manufacturing mold type semiconductor device

Semiconductor equipment having a pair of heat radiation plates

Semiconductor device having heat radiation plate and bonding member

Mold type semiconductor device and method for manufacturing the same