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Nobuyuki Kurashima

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  • Nagano, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Loop-type heat pipe with vapor moving path in liquid pipe
    • Patent number 11,592,240
    • Issue date Feb 28, 2023
    • Shinko Electric Industries Co., Ltd.
    • Yoshihiro Machida
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Grant

    Heat pipe
    • Patent number 11,384,993
    • Issue date Jul 12, 2022
    • Shinko Electric Industries Co., Ltd.
    • Nobuyuki Kurashima
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Grant

    Loop heat pipe
    • Patent number 11,333,443
    • Issue date May 17, 2022
    • Shinko Electric Industries Co., Ltd.
    • Koichi Tanaka
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Grant

    Flat loop heat pipe
    • Patent number 11,143,461
    • Issue date Oct 12, 2021
    • Shinko Electric Industries Co., Ltd.
    • Nobuyuki Kurashima
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Grant

    Loop heat pipe
    • Patent number 10,962,301
    • Issue date Mar 30, 2021
    • Shinko Electric Industries Co., Ltd.
    • Nobuyuki Kurashima
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Grant

    Loop heat pipe and method of manufacturing loop heat pipe
    • Patent number 10,712,098
    • Issue date Jul 14, 2020
    • Shinko Electric Industries Co., Ltd.
    • Nobuyuki Kurashima
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Grant

    Loop heat pipe
    • Patent number 10,704,838
    • Issue date Jul 7, 2020
    • Shinko Electric Industries Co., Ltd.
    • Yoshihiro Machida
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Grant

    Loop heat pipe and electronic device
    • Patent number 10,524,388
    • Issue date Dec 31, 2019
    • Shinko Electric Industries Co., Ltd.
    • Yoshihiro Machida
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Loop heat pipe and electronic device
    • Patent number 10,495,386
    • Issue date Dec 3, 2019
    • Shinko Electric Industries Co., Ltd.
    • Takahiko Kiso
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Grant

    Heat pipe
    • Patent number 10,497,640
    • Issue date Dec 3, 2019
    • Shinko Electric Industries Co., Ltd.
    • Nobuyuki Kurashima
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Grant

    Loop heat pipe
    • Patent number 10,408,546
    • Issue date Sep 10, 2019
    • Shinko Electric Industries Co., Ltd.
    • Nobuyuki Kurashima
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Grant

    Heat pipe
    • Patent number 10,352,626
    • Issue date Jul 16, 2019
    • Shinko Electric Industries Co., Ltd.
    • Nobuyuki Kurashima
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Grant

    Electronic component incorporated substrate and method for manufact...
    • Patent number 9,137,900
    • Issue date Sep 15, 2015
    • Shinko Electric Industries Co., Ltd.
    • Koichi Tanaka
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Electronic component built-in substrate
    • Patent number 9,059,088
    • Issue date Jun 16, 2015
    • Shinko Electric Industries Co., Ltd.
    • Nobuyuki Kurashima
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Electronic component incorporated substrate
    • Patent number 9,036,362
    • Issue date May 19, 2015
    • Shinko Electric Industries Co., Ltd.
    • Koichi Tanaka
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Built-in electronic component substrate and method for manufacturin...
    • Patent number 8,987,919
    • Issue date Mar 24, 2015
    • Shinko Electric Industries Co., Ltd.
    • Koichi Tanaka
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor device
    • Patent number 8,736,053
    • Issue date May 27, 2014
    • Shinko Electric Industries Co., Ltd.
    • Koichi Tanaka
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method of manufacturing electronic component integrated substrate
    • Patent number 7,827,681
    • Issue date Nov 9, 2010
    • Shinko Electric Industries Co., Ltd.
    • Nobuyuki Kurashima
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Through electrode and method for forming the same
    • Patent number 7,498,259
    • Issue date Mar 3, 2009
    • Shinko Electric Industries Co., Ltd.
    • Takaharu Yamano
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Method of manufacturing semiconductor device
    • Patent number 7,105,423
    • Issue date Sep 12, 2006
    • Shinko Electric Industries Co., Ltd.
    • Takaharu Yamano
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    FLAT LOOP HEAT PIPE
    • Publication number 20220011055
    • Publication date Jan 13, 2022
    • Shinko Electric Industries Co., LTD.
    • Nobuyuki Kurashima
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    LOOP-TYPE HEAT PIPE
    • Publication number 20200378686
    • Publication date Dec 3, 2020
    • Shinko Electric Industries Co., Ltd.
    • Yoshihiro Machida
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    LOOP HEAT PIPE
    • Publication number 20200096261
    • Publication date Mar 26, 2020
    • Shinko Electric Industries Co., LTD.
    • Koichi Tanaka
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    LOOP HEAT PIPE
    • Publication number 20200025463
    • Publication date Jan 23, 2020
    • Shinko Electric Industries Co., Ltd.
    • Nobuyuki KURASHIMA
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    HEAT PIPE
    • Publication number 20190277574
    • Publication date Sep 12, 2019
    • Shinko Electric Industries Co., Ltd.
    • Nobuyuki KURASHIMA
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    FLAT LOOP HEAT PIPE
    • Publication number 20190264989
    • Publication date Aug 29, 2019
    • Shinko Electric Industries Co., LTD.
    • Nobuyuki Kurashima
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    LOOP HEAT PIPE AND ELECTRONIC DEVICE
    • Publication number 20190204017
    • Publication date Jul 4, 2019
    • Shinko Electric Industries Co., Ltd.
    • Takahiko KISO
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    LOOP HEAT PIPE AND ELECTRONIC DEVICE
    • Publication number 20190090385
    • Publication date Mar 21, 2019
    • Shinko Electric Industries Co., LTD.
    • Yoshihiro Machida
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LOOP HEAT PIPE AND METHOD OF MANUFACTURING LOOP HEAT PIPE
    • Publication number 20190017749
    • Publication date Jan 17, 2019
    • Shinko Electric Industries Co., Ltd.
    • Nobuyuki KURASHIMA
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    HEAT PIPE
    • Publication number 20190013257
    • Publication date Jan 10, 2019
    • Shinko Electric Industries Co., LTD.
    • Nobuyuki Kurashima
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    HEAT PIPE
    • Publication number 20180164043
    • Publication date Jun 14, 2018
    • Shinko Electric Industries Co., Ltd.
    • Nobuyuki KURASHIMA
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    LOOP HEAT PIPE
    • Publication number 20180142960
    • Publication date May 24, 2018
    • Shinko Electric Industries Co., Ltd.
    • Nobuyuki KURASHIMA
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    LOOP HEAT PIPE
    • Publication number 20180058767
    • Publication date Mar 1, 2018
    • Shinko Electric Industries Co., Ltd.
    • Yoshihiro MACHIDA
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    BUILT-IN ELECTRONIC COMPONENT SUBSTRATE AND METHOD FOR MANUFACTURIN...
    • Publication number 20140210109
    • Publication date Jul 31, 2014
    • Shinko Electric Industries Co., Ltd.
    • Koichi TANAKA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC COMPONENT INCORPORATED SUBSTRATE
    • Publication number 20140063764
    • Publication date Mar 6, 2014
    • Shinko Electric Industries Co., LTD.
    • Koichi TANAKA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC COMPONENT INCORPORATED SUBSTRATE AND METHOD FOR MANUFACT...
    • Publication number 20140063768
    • Publication date Mar 6, 2014
    • Shinko Electric Industries Co., LTD.
    • Koichi Tanaka
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC COMPONENT BUILT-IN SUBSTRATE AND METHOD OF MANUFACTURING...
    • Publication number 20140054773
    • Publication date Feb 27, 2014
    • Nobuyuki KURASHIMA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
    • Publication number 20120319274
    • Publication date Dec 20, 2012
    • Shinko Electric Industries Co., Ltd.
    • Koichi TANAKA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MOLD RESIN MOLDING METHOD AND MOLD RESIN MOLDING APPARATUS
    • Publication number 20100155992
    • Publication date Jun 24, 2010
    • Shinko Electric Industries Co., Ltd.
    • Nobuyuki Kurashima
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Application

    METHOD OF MANUFACTURING ELECTRONIC COMPONENT INTEGRATED SUBSTRATE
    • Publication number 20080307642
    • Publication date Dec 18, 2008
    • Shinko Electric Industries Co., Ltd.
    • Nobuyuki Kurashima
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Through electrode and method for forming the same
    • Publication number 20060267210
    • Publication date Nov 30, 2006
    • Takaharu Yamano
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Through electrode and method for forming the same
    • Publication number 20060001173
    • Publication date Jan 5, 2006
    • Takaharu Yamano
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Method of manufacturing semiconductor device
    • Publication number 20050255686
    • Publication date Nov 17, 2005
    • Takaharu Yamano
    • H01 - BASIC ELECTRIC ELEMENTS