Nobuyuki Mori

Follow

Person

Kumamoto, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wire-bonded semiconductor device
- Patent number 6,005,293
- Issue date Dec 21, 1999
- NEC Corporation
- Nobuyuki Mori
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Dicing machine and adapter for dicing machine
- Publication number 20100122617
- Publication date May 20, 2010
- NEC Electronics Corporation
- Nobuyuki Mori
- B28 - WORKING CEMENT, CLAY, OR STONE