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Nobuyuki Naka
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Kyoto, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Probe manufacturing method and probe
Patent number
10,900,905
Issue date
Jan 26, 2021
Horiba, Ltd.
Masayuki Nishi
G01 - MEASURING TESTING
Information
Patent Grant
Stress component measurement method
Patent number
7,668,668
Issue date
Feb 23, 2010
Horiba, Ltd.
Nobuyuki Naka
G01 - MEASURING TESTING
Information
Patent Grant
Stress measurement method
Patent number
7,623,223
Issue date
Nov 24, 2009
Horiba, Ltd.
Nobuyuki Naka
G01 - MEASURING TESTING
Information
Patent Grant
Substrate inspection apparatus and method
Patent number
7,327,444
Issue date
Feb 5, 2008
Horiba, Ltd.
Nobuyuki Naka
G01 - MEASURING TESTING
Information
Patent Grant
Method of and apparatus for measuring stress of semiconductor material
Patent number
7,295,307
Issue date
Nov 13, 2007
Horiba, Ltd.
Nobuyuki Naka
G01 - MEASURING TESTING
Patents Applications
last 30 patents
Information
Patent Application
PROBE MANUFACTURING METHOD AND PROBE
Publication number
20190170651
Publication date
Jun 6, 2019
KYOTO UNIVERSITY
Masayuki NISHI
G01 - MEASURING TESTING
Information
Patent Application
STRESS COMPONENT MEASUREMENT METHOD
Publication number
20080086276
Publication date
Apr 10, 2008
Nobuyuki Naka
G01 - MEASURING TESTING
Information
Patent Application
STRESS MEASUREMENT METHOD
Publication number
20080084552
Publication date
Apr 10, 2008
Nobuyuki Naka
G01 - MEASURING TESTING
Information
Patent Application
Method of and apparatus for measuring stress of semiconductor material
Publication number
20060049480
Publication date
Mar 9, 2006
Nobuyuki Naka
G01 - MEASURING TESTING
Information
Patent Application
Substrate inspection apparatus and method
Publication number
20060038980
Publication date
Feb 23, 2006
Nobuyuki Naka
G01 - MEASURING TESTING