Nobuyuki Takeyasu

Person

Chiba, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for making metal interconnection
- Patent number 6,063,703
- Issue date May 16, 2000
- Kawasaki Steel Corporation
- Hiroshi Shinriki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device and an apparatus for m...
- Patent number 6,001,736
- Issue date Dec 14, 1999
- Kawasaki Steel Corporation
- Eiichi Kondo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal interconnection and method for making
- Patent number 5,973,402
- Issue date Oct 26, 1999
- Kawasaki Steel Corporation
- Hiroshi Shinriki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a multilevel interconnection structure
- Patent number 5,952,723
- Issue date Sep 14, 1999
- Kawasaki Steel Corporation
- Nobuyuki Takeyasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilevel interconnect method of manufacturing
- Patent number 5,946,799
- Issue date Sep 7, 1999
- Kawasaki Steel Corporation
- Hiroshi Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device with contact structure
- Patent number 5,652,180
- Issue date Jul 29, 1997
- Kawasaki Steel Corporation
- Hiroshi Shinriki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device having multilevel inte...
- Patent number 5,637,534
- Issue date Jun 10, 1997
- Kawasaki Steel Corporation
- Nobuyuki Takeyasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making metal interconnection with chlorine plasma etch
- Patent number 5,627,102
- Issue date May 6, 1997
- Kawasaki Steel Corporation
- Hiroshi Shinriki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilevel interconnect structure
- Patent number 5,627,345
- Issue date May 6, 1997
- Kawasaki Steel Corporation
- Hiroshi Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming multilayered wiring structure in semiconductor de...
- Patent number 5,486,492
- Issue date Jan 23, 1996
- Kawasaki Steel Corporation
- Hiroshi Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS

Nobuyuki Takeyasu

Person

Patents Grantslast 30 patents

Method for making metal interconnection

Method of manufacturing semiconductor device and an apparatus for m...

Metal interconnection and method for making

Semiconductor device having a multilevel interconnection structure

Multilevel interconnect method of manufacturing

Method of manufacturing semiconductor device with contact structure

Method of manufacturing semiconductor device having multilevel inte...

Method for making metal interconnection with chlorine plasma etch

Multilevel interconnect structure

Method of forming multilayered wiring structure in semiconductor de...