Nobuyuki Terasaki

Person

Saitama-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Bonded body, power module substrate, power module, method for manuf...
- Patent number 12,199,006
- Issue date Jan 14, 2025
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper/ceramic bonded body, insulating circuit substrate, copper/ce...
- Patent number 12,168,634
- Issue date Dec 17, 2024
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Insulated circuit board
- Patent number 12,089,342
- Issue date Sep 10, 2024
- Mitsubishi Materials Corporation
- Akira Sakurai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper/ceramic bonded body, insulating circuit substrate, copper/ce...
- Patent number 12,037,294
- Issue date Jul 16, 2024
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonded body, insulated circuit board with heat sink, and heat sink
- Patent number 12,035,468
- Issue date Jul 9, 2024
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonded body of copper and ceramic, insulating circuit substrate, bo...
- Patent number 12,027,434
- Issue date Jul 2, 2024
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper/ceramic assembly, insulated circuit board, method for produc...
- Patent number 12,002,732
- Issue date Jun 4, 2024
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper/titanium/aluminum joint, insulating circuit substrate, insul...
- Patent number 11,887,909
- Issue date Jan 30, 2024
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic/aluminum bonded body, insulating substrate, LED module, cer...
- Patent number 11,798,856
- Issue date Oct 24, 2023
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper/ceramic bonded body, insulating circuit board, method for pr...
- Patent number 11,638,350
- Issue date Apr 25, 2023
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper/ceramic bonded body, insulating circuit substrate, copper/ce...
- Patent number 11,396,059
- Issue date Jul 26, 2022
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonded body, power module substrate, power module, method for manuf...
- Patent number 11,393,738
- Issue date Jul 19, 2022
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded body and insulated circuit board
- Patent number 11,177,186
- Issue date Nov 16, 2021
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded body and insulated circuit board
- Patent number 11,139,218
- Issue date Oct 5, 2021
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded body, insulated circuit board with heat sink, and heat sink
- Patent number 11,094,606
- Issue date Aug 17, 2021
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded body, power module substrate, method for manufacturing bonde...
- Patent number 11,062,974
- Issue date Jul 13, 2021
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Copper-ceramic bonded body and insulation circuit substrate
- Patent number 11,028,022
- Issue date Jun 8, 2021
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded body and insulating circuit substrate
- Patent number 10,998,250
- Issue date May 4, 2021
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper/ceramic joined body, insulated circuit board, method for pro...
- Patent number 10,818,585
- Issue date Oct 27, 2020
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Method for manufacturing insulated circuit board, insulated circuit...
- Patent number 10,798,824
- Issue date Oct 6, 2020
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic-aluminum conjugate, power module substrate, and power module
- Patent number 10,607,907
- Issue date Mar 31, 2020
- Mitsubishi Materials Corporation
- Yoshirou Kuromitsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonded body, power module substrate with heat sink, heat sink, meth...
- Patent number 10,600,719
- Issue date Mar 24, 2020
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic/aluminum joined body, insulating circuit board, power modul...
- Patent number 10,526,252
- Issue date Jan 7, 2020
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Bonded body, substrate for power module with heat sink, heat sink,...
- Patent number 10,497,585
- Issue date Dec 3, 2019
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded body, substrate for power module with heat sink, heat sink,...
- Patent number 10,497,637
- Issue date Dec 3, 2019
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonded body, substrate for power module with heat sink, heat sink,...
- Patent number 10,410,951
- Issue date Sep 10, 2019
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for producing bonded body and process for producing power m...
- Patent number 10,370,303
- Issue date Aug 6, 2019
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power module substrate, power module substrate with heat sink, powe...
- Patent number 10,375,825
- Issue date Aug 6, 2019
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonded body, substrate for power module with heat sink, heat sink,...
- Patent number 10,319,664
- Issue date Jun 11, 2019
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonded body, power module substrate with heat sink, heat sink, meth...
- Patent number 10,283,431
- Issue date May 7, 2019
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COPPER/CERAMIC JOINED BODY AND INSULATED CIRCUIT BOARD
- Publication number 20240414841
- Publication date Dec 12, 2024
- MITSUBISHI MATERIALS CORPORATION
- Akira Sakurai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER/CERAMIC BONDED BODY AND INSULATING CIRCUIT SUBSTRATE
- Publication number 20240363480
- Publication date Oct 31, 2024
- MITSUBISHI MATERIALS CORPORATION
- Nobuyuki Terasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER/CERAMIC BONDED BODY AND INSULATING CIRCUIT SUBSTRATE
- Publication number 20240363481
- Publication date Oct 31, 2024
- MITSUBISHI MATERIALS CORPORATION
- Nobuyuki Terasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER/CERAMIC ASSEMBLY, INSULATING CIRCUIT SUBSTRATE, PRODUCTION M...
- Publication number 20240274497
- Publication date Aug 15, 2024
- MITSUBISHI MATERIALS CORPORATION
- Nobuyuki Terasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER/CERAMIC ASSEMBLY AND INSULATING CIRCUIT SUBSTRATE
- Publication number 20240234242
- Publication date Jul 11, 2024
- MITSUBISHI MATERIALS CORPORATION
- Nobuyuki Terasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER/CERAMIC BONDED BODY AND INSULATING CIRCUIT SUBSTRATE
- Publication number 20240203819
- Publication date Jun 20, 2024
- MITSUBISHI MATERIALS CORPORATION
- Nobuyuki Terasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER/CERAMIC BONDED BODY AND INSULATED CIRCUIT SUBSTRATE
- Publication number 20230197556
- Publication date Jun 22, 2023
- MITSUBISHI MATERIALS CORPORATION
- Satoshi Takakuwa
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
COPPER-GRAPHENE BONDED BODY AND METHOD FOR MANUFACTURING SAME, AND...
- Publication number 20230127611
- Publication date Apr 27, 2023
- MITSUBISHI MATERIALS CORPORATION
- Nobuyuki Terasaki
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
INSULATED CIRCUIT BOARD
- Publication number 20230091454
- Publication date Mar 23, 2023
- MITSUBISHI MATERIALS CORPORATION
- Akira Sakurai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER-CERAMIC BONDED BODY, INSULATED CIRCUIT BOARD, METHOD FOR PRO...
- Publication number 20230034784
- Publication date Feb 2, 2023
- MITSUBISHI MATERIALS CORPORATION
- Nobuyuki Terasaki
- B32 - LAYERED PRODUCTS
Information Patent Application
COPPER/CERAMIC JOINED BODY AND INSULATED CIRCUIT BOARD
- Publication number 20230022285
- Publication date Jan 26, 2023
- MITSUBISHI MATERIALS CORPORATION
- Nobuyuki Terasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC/COPPER/GRAPHENE ASSEMBLY AND METHOD FOR MANUFACTURING SAME,...
- Publication number 20220410529
- Publication date Dec 29, 2022
- MITSUBISHI MATERIALS CORPORATION
- Nobuyuki Terasaki
- B32 - LAYERED PRODUCTS
Information Patent Application
COPPER/CERAMIC JOINED BODY AND INSULATING CIRCUIT SUBSTRATE
- Publication number 20220406677
- Publication date Dec 22, 2022
- MITSUBISHI MATERIALS CORPORATION
- Nobuyuki Terasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER/CERAMIC ASSEMBLY AND INSULATED CIRCUIT BOARD
- Publication number 20220375819
- Publication date Nov 24, 2022
- MITSUBISHI MATERIALS CORPORATION
- Nobuyuki Terasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER/CERAMIC ASSEMBLY, INSULATED CIRCUIT BOARD, METHOD FOR PRODUC...
- Publication number 20220359340
- Publication date Nov 10, 2022
- MITSUBISHI MATERIALS CORPORATION
- Nobuyuki Terasaki
- B32 - LAYERED PRODUCTS
Information Patent Application
COPPER/CERAMIC BONDED BODY, INSULATING CIRCUIT BOARD, METHOD FOR PR...
- Publication number 20220353989
- Publication date Nov 3, 2022
- MITSUBISHI MATERIALS CORPORATION
- Nobuyuki Terasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDED BODY, POWER MODULE SUBSTRATE, POWER MODULE, METHOD FOR MANUF...
- Publication number 20220278019
- Publication date Sep 1, 2022
- MITSUBISHI MATERIALS CORPORATION
- Nobuyuki TERASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER/CERAMIC ASSEMBLY, INSULATED CIRCUIT BOARD, METHOD FOR PRODUC...
- Publication number 20220230935
- Publication date Jul 21, 2022
- MITSUBISHI MATERIALS CORPORATION
- Nobuyuki Terasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER/CERAMIC JOINED BODY, INSULATING CIRCUIT SUBSTRATE, COPPER/CE...
- Publication number 20220223492
- Publication date Jul 14, 2022
- MITSUBISHI MATERIALS CORPORATION
- Nobuyuki Terasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER/CERAMIC JOINED BODY, INSULATION CIRCUIT BOARD, COPPER/CERAMI...
- Publication number 20220051965
- Publication date Feb 17, 2022
- MITSUBISHI MATERIALS CORPORATION
- Nobuyuki Terasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED BODY, HEAT SINK-ATTACHED INSULATED CIRCUIT BOARD, AND HEAT SINK
- Publication number 20220001482
- Publication date Jan 6, 2022
- MITSUBISHI MATERIALS CORPORATION
- Nobuyuki Terasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDED BODY, INSULATED CIRCUIT BOARD WITH HEAT SINK, AND HEAT SINK
- Publication number 20210410284
- Publication date Dec 30, 2021
- MITSUBISHI MATERIALS CORPORATION
- Nobuyuki Terasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER/CERAMIC BONDED BODY, INSULATING CIRCUIT SUBSTRATE, COPPER/CE...
- Publication number 20210238102
- Publication date Aug 5, 2021
- MITSUBISHI MATERIALS CORPORATION
- Nobuyuki Terasaki
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
COPPER/CERAMIC BONDED BODY, INSULATING CIRCUIT SUBSTRATE, COPPER/CE...
- Publication number 20210238103
- Publication date Aug 5, 2021
- MITSUBISHI MATERIALS CORPORATION
- Nobuyuki Terasaki
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
COPPER/CERAMIC BONDED BODY, INSULATING CIRCUIT SUBSTRATE, COPPER/CE...
- Publication number 20210178509
- Publication date Jun 17, 2021
- MITSUBISHI MATERIALS CORPORATION
- Nobuyuki Terasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER MODULE SUBSTRATE, POWER MODULE SUBSTRATE WITH HEAT SINK, POWE...
- Publication number 20210068251
- Publication date Mar 4, 2021
- MITSUBISHI MATERIALS CORPORATION
- Nobuyuki Terasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDED BODY, POWER MODULE SUBSTRATE, POWER MODULE, METHOD FOR MANUF...
- Publication number 20210043540
- Publication date Feb 11, 2021
- MITSUBISHI MATERIALS CORPORATION
- Nobuyuki TERASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED BODY OF COPPER AND CERAMIC, INSULATING CIRCUIT SUBSTRATE, BO...
- Publication number 20200365475
- Publication date Nov 19, 2020
- MITSUBISHI MATERIALS CORPORATION
- Nobuyuki Terasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER/TITANIUM/ALUMINUM JOINT, INSULATING CIRCUIT SUBSTRATE, INSUL...
- Publication number 20200343158
- Publication date Oct 29, 2020
- MITSUBISHI MATERIALS CORPORATION
- Nobuyuki Terasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED BODY AND INSULATING CIRCUIT SUBSTRATE
- Publication number 20200321264
- Publication date Oct 8, 2020
- MITSUBISHI MATERIALS CORPORATION
- Nobuyuki Terasaki
- H01 - BASIC ELECTRIC ELEMENTS

Nobuyuki Terasaki

Person

Patents Grantslast 30 patents

Bonded body, power module substrate, power module, method for manuf...

Copper/ceramic bonded body, insulating circuit substrate, copper/ce...

Insulated circuit board

Copper/ceramic bonded body, insulating circuit substrate, copper/ce...

Bonded body, insulated circuit board with heat sink, and heat sink

Bonded body of copper and ceramic, insulating circuit substrate, bo...

Copper/ceramic assembly, insulated circuit board, method for produc...

Copper/titanium/aluminum joint, insulating circuit substrate, insul...

Ceramic/aluminum bonded body, insulating substrate, LED module, cer...

Copper/ceramic bonded body, insulating circuit board, method for pr...

Copper/ceramic bonded body, insulating circuit substrate, copper/ce...

Bonded body, power module substrate, power module, method for manuf...

Bonded body and insulated circuit board

Bonded body and insulated circuit board

Bonded body, insulated circuit board with heat sink, and heat sink

Bonded body, power module substrate, method for manufacturing bonde...

Copper-ceramic bonded body and insulation circuit substrate

Bonded body and insulating circuit substrate

Copper/ceramic joined body, insulated circuit board, method for pro...

Method for manufacturing insulated circuit board, insulated circuit...

Ceramic-aluminum conjugate, power module substrate, and power module

Bonded body, power module substrate with heat sink, heat sink, meth...

Ceramic/aluminum joined body, insulating circuit board, power modul...

Bonded body, substrate for power module with heat sink, heat sink,...

Bonded body, substrate for power module with heat sink, heat sink,...

Bonded body, substrate for power module with heat sink, heat sink,...

Process for producing bonded body and process for producing power m...

Power module substrate, power module substrate with heat sink, powe...

Bonded body, substrate for power module with heat sink, heat sink,...

Bonded body, power module substrate with heat sink, heat sink, meth...

Patents Applicationslast 30 patents

COPPER/CERAMIC JOINED BODY AND INSULATED CIRCUIT BOARD

COPPER/CERAMIC BONDED BODY AND INSULATING CIRCUIT SUBSTRATE

COPPER/CERAMIC BONDED BODY AND INSULATING CIRCUIT SUBSTRATE

COPPER/CERAMIC ASSEMBLY, INSULATING CIRCUIT SUBSTRATE, PRODUCTION M...

COPPER/CERAMIC ASSEMBLY AND INSULATING CIRCUIT SUBSTRATE

COPPER/CERAMIC BONDED BODY AND INSULATING CIRCUIT SUBSTRATE

COPPER/CERAMIC BONDED BODY AND INSULATED CIRCUIT SUBSTRATE

COPPER-GRAPHENE BONDED BODY AND METHOD FOR MANUFACTURING SAME, AND...

INSULATED CIRCUIT BOARD

COPPER-CERAMIC BONDED BODY, INSULATED CIRCUIT BOARD, METHOD FOR PRO...

COPPER/CERAMIC JOINED BODY AND INSULATED CIRCUIT BOARD

CERAMIC/COPPER/GRAPHENE ASSEMBLY AND METHOD FOR MANUFACTURING SAME,...

COPPER/CERAMIC JOINED BODY AND INSULATING CIRCUIT SUBSTRATE

COPPER/CERAMIC ASSEMBLY AND INSULATED CIRCUIT BOARD

COPPER/CERAMIC ASSEMBLY, INSULATED CIRCUIT BOARD, METHOD FOR PRODUC...

COPPER/CERAMIC BONDED BODY, INSULATING CIRCUIT BOARD, METHOD FOR PR...

BONDED BODY, POWER MODULE SUBSTRATE, POWER MODULE, METHOD FOR MANUF...

COPPER/CERAMIC ASSEMBLY, INSULATED CIRCUIT BOARD, METHOD FOR PRODUC...

COPPER/CERAMIC JOINED BODY, INSULATING CIRCUIT SUBSTRATE, COPPER/CE...

COPPER/CERAMIC JOINED BODY, INSULATION CIRCUIT BOARD, COPPER/CERAMI...

BONDED BODY, HEAT SINK-ATTACHED INSULATED CIRCUIT BOARD, AND HEAT SINK

BONDED BODY, INSULATED CIRCUIT BOARD WITH HEAT SINK, AND HEAT SINK

COPPER/CERAMIC BONDED BODY, INSULATING CIRCUIT SUBSTRATE, COPPER/CE...

COPPER/CERAMIC BONDED BODY, INSULATING CIRCUIT SUBSTRATE, COPPER/CE...

COPPER/CERAMIC BONDED BODY, INSULATING CIRCUIT SUBSTRATE, COPPER/CE...

POWER MODULE SUBSTRATE, POWER MODULE SUBSTRATE WITH HEAT SINK, POWE...

BONDED BODY, POWER MODULE SUBSTRATE, POWER MODULE, METHOD FOR MANUF...

BONDED BODY OF COPPER AND CERAMIC, INSULATING CIRCUIT SUBSTRATE, BO...

COPPER/TITANIUM/ALUMINUM JOINT, INSULATING CIRCUIT SUBSTRATE, INSUL...

BONDED BODY AND INSULATING CIRCUIT SUBSTRATE