Norbert Mais

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Nuernberg, DE

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Patents Grantslast 30 patents

Information Patent Grant
Barrier for power metallization in semiconductor devices
- Patent number 11,127,693
- Issue date Sep 21, 2021
- Infineon Technologies AG
- Johann Gatterbauer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Protection layers for conductive pads and methods of formation thereof
- Patent number 8,835,319
- Issue date Sep 16, 2014
- Infineon Technologies AG
- Dirk Meinhold
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method of Forming a Layer Structure, Layer Structure, Method of For...
- Publication number 20200227278
- Publication date Jul 16, 2020
- Johann Gatterbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Barrier for Power Metallization in Semiconductor Devices
- Publication number 20200111754
- Publication date Apr 9, 2020
- Johann Gatterbauer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Protection Layers for Conductive Pads and Methods of Formation Thereof
- Publication number 20140319688
- Publication date Oct 30, 2014
- Dirk Meinhold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Protection Layers for Conductive Pads and Methods of Formation Thereof
- Publication number 20130228929
- Publication date Sep 5, 2013
- INFINEON TECHNOLOGIES AG
- Dirk Meinhold
- H01 - BASIC ELECTRIC ELEMENTS