Norbert Sickmann

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Burghausen, DE

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Patents Grantslast 30 patents

Information Patent Grant
Method and device for polishing semiconductor wafers
- Patent number 5,980,361
- Issue date Nov 9, 1999
- Wacker Siltronic Gesellschaft fur Halbleitermaterialien AG
- Paul Muller
- B24 - GRINDING POLISHING