Noriaki Fujiki

Person

Hyogo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device including fuse elements and bonding pad
- Patent number 7,423,301
- Issue date Sep 9, 2008
- Renesas Technology Corp.
- Noriaki Fujiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device including bonding pad...
- Patent number 7,335,537
- Issue date Feb 26, 2008
- Renesas Technology Corp.
- Noriaki Fujiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including fuse elements and bonding pad
- Patent number 7,217,965
- Issue date May 15, 2007
- Renesas Technology Corp.
- Noriaki Fujiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including copper interconnect line and bonding...
- Patent number 6,888,258
- Issue date May 3, 2005
- Renesas Technology Corp.
- Takeru Matsuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer interconnection structure including an alignment mark
- Patent number 6,677,682
- Issue date Jan 13, 2004
- Renesas Technology Corp.
- Noriaki Fujiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,586,838
- Issue date Jul 1, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Noriaki Fujiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,339,257
- Issue date Jan 15, 2002
- Mitsubishi Denki Kabushiki Kaisha
- Noriaki Fujiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for manufacturing a semiconductor integrated c...
- Patent number 6,283,835
- Issue date Sep 4, 2001
- Mitsubishi Denki Kabushiki Kaisha
- Shigeru Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for manufacturing a semiconductor integrated c...
- Patent number 6,178,972
- Issue date Jan 30, 2001
- Mitsubishi Denki Kabushiki Kaisha
- Shigeru Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and bonding pad structure therefor
- Patent number 5,736,791
- Issue date Apr 7, 1998
- Mitsubishi Denki Kabushiki Kaisha
- Noriaki Fujiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including silicon ladder resin layer
- Patent number 5,510,653
- Issue date Apr 23, 1996
- Mitsubishi Denki Kabushiki Kaisha
- Noriaki Fujiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure of semiconductor integrated circuit devic...
- Patent number 5,488,014
- Issue date Jan 30, 1996
- Mitsubishi Denki Kabushiki Kaisha
- Shigeru Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure of semiconductor integrated circuit device
- Patent number 5,313,101
- Issue date May 17, 1994
- Mitsubishi Denki Kabushiki Kaisha
- Shigeru Harada
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor device including fuse elements and bonding pad
- Publication number 20090001508
- Publication date Jan 1, 2009
- Renesas Technology Corp.
- Noriaki Fujiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device including fuse elements and bonding pad
- Publication number 20070176257
- Publication date Aug 2, 2007
- Renesas Technology Corp.
- Noriaki Fujiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor device including bonding pad...
- Publication number 20070176258
- Publication date Aug 2, 2007
- Renesas Technology Corp.
- Noriaki Fujiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20040195648
- Publication date Oct 7, 2004
- Renesas Technology Corp.
- Noriaki Fujiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING COPPER INTERCONNECT LINE AND BONDING...
- Publication number 20040183197
- Publication date Sep 23, 2004
- Renesas Technology Corp.
- Takeru Matsuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device including a capacitor
- Publication number 20040036098
- Publication date Feb 26, 2004
- Mitsubishi Denki Kabushiki Kaisha
- Noriaki Fujiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20030214040
- Publication date Nov 20, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Takashi Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor device
- Publication number 20030100177
- Publication date May 29, 2003
- Hiroki Takewaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20020117755
- Publication date Aug 29, 2002
- Mitsubishi Denki Kabushiki Kaisha
- Noriaki Fujiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20020011669
- Publication date Jan 31, 2002
- NORIAKI FUJIKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for manufacturing a semiconductor integrated c...
- Publication number 20010000199
- Publication date Apr 12, 2001
- Shigeru Harada
- H01 - BASIC ELECTRIC ELEMENTS

Noriaki Fujiki

Person

Patents Grantslast 30 patents

Semiconductor device including fuse elements and bonding pad

Method of manufacturing semiconductor device including bonding pad...

Semiconductor device including fuse elements and bonding pad

Semiconductor device including copper interconnect line and bonding...

Multilayer interconnection structure including an alignment mark

Semiconductor device

Semiconductor device

Method and apparatus for manufacturing a semiconductor integrated c...

Method and apparatus for manufacturing a semiconductor integrated c...

Semiconductor device and bonding pad structure therefor

Semiconductor device including silicon ladder resin layer

Interconnection structure of semiconductor integrated circuit devic...

Interconnection structure of semiconductor integrated circuit device

Patents Applicationslast 30 patents

Semiconductor device including fuse elements and bonding pad

Semiconductor device including fuse elements and bonding pad

Method of manufacturing semiconductor device including bonding pad...

Semiconductor device

SEMICONDUCTOR DEVICE INCLUDING COPPER INTERCONNECT LINE AND BONDING...

Semiconductor device including a capacitor

Semiconductor device and method of manufacturing the same

Method of manufacturing semiconductor device

Semiconductor device

SEMICONDUCTOR DEVICE

Method and apparatus for manufacturing a semiconductor integrated c...