Noriaki MUKAI

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Suwon, KR

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Patents Grantslast 30 patents

Information Patent Grant
Solder bump forming apparatus and soldering facility including the...
- Patent number 8,651,356
- Issue date Feb 18, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Noriaki Mukai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MASK FOR BUMPING SOLDER BALLS ON CIRCUIT BOARD AND SOLDER BALL BUMP...
- Publication number 20140103098
- Publication date Apr 17, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Jin Won Choi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER BUMP FORMING APPARATUS AND SOLDERING FACILITY INCLUDING THE...
- Publication number 20130134208
- Publication date May 30, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Noriaki MUKAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER BUMP FORMING APPARATUS AND SOLDERING FACILITY INCLUDING THE...
- Publication number 20130134207
- Publication date May 30, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Noriaki MUKAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR