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Noriaki Mukai

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Patents Grantslast 30 patents

  • Information Patent Grant

    Printed substrate manufacturing equipment and manufacturing method
    • Patent number 8,921,157
    • Issue date Dec 30, 2014
    • Hitachi, Ltd.
    • Noriaki Mukai
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Micro-bump forming apparatus
    • Patent number 8,302,838
    • Issue date Nov 6, 2012
    • Hitachi Plant Technologies, Ltd.
    • Noriaki Mukai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Solder ball printing apparatus
    • Patent number 8,038,050
    • Issue date Oct 18, 2011
    • Hitachi Plant Technologies, Ltd.
    • Makoto Honma
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Solder ball printing apparatus
    • Patent number 7,896,223
    • Issue date Mar 1, 2011
    • Hitachi Plant Technologies, Ltd.
    • Makoto Honma
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Screen printing apparatus
    • Patent number 6,237,484
    • Issue date May 29, 2001
    • Hitachi Techno Engineering Co., Ltd.
    • Makoto Homma
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Screen printer
    • Patent number 5,176,076
    • Issue date Jan 5, 1993
    • Hitachi Techno Engineering Co., Ltd.
    • Nobuyuki Azuma
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Method and apparatus for screen printing
    • Patent number 4,981,074
    • Issue date Jan 1, 1991
    • Hitachi Techno Engineering Co., Ltd.
    • Tetuji Machita
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Apparatus for fixing electronic parts to printed circuit board
    • Patent number 4,809,443
    • Issue date Mar 7, 1989
    • Hitachi Techno Engineering Co., Ltd.
    • Haruo Mishina
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Apparatus for fixing electronic parts to printed circuit board
    • Patent number 4,776,105
    • Issue date Oct 11, 1988
    • Hitachi Techno Engineering Co., Ltd.
    • Haruo Mishina
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    PRINTED SUBSTRATE MANUFACTURING EQUIPMENT AND MANUFACTURING METHOD
    • Publication number 20120244666
    • Publication date Sep 27, 2012
    • Noriaki MUKAI
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    MICRO-BUMP FORMING APPARATUS
    • Publication number 20110284618
    • Publication date Nov 24, 2011
    • Hitachi Plant Technologies, Ltd.
    • Noriaki MUKAI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SOLDER BALL PRINTING APPARATUS AND SOLDER BALL PRINTING METHOD
    • Publication number 20100272884
    • Publication date Oct 28, 2010
    • Hitachi Plant Technologies, Ltd.
    • Akio Igarashi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SOLDER BALL PRINTING APPARATUS
    • Publication number 20100270357
    • Publication date Oct 28, 2010
    • Hitachi Plant Technologies, Ltd.
    • Makoto HONMA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SOLDER BALL PRINTING APPARATUS
    • Publication number 20100072259
    • Publication date Mar 25, 2010
    • Hitachi Plant Technologies, Ltd.
    • Makoto HONMA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR