Norifumi KAWAMURA

Person

Annaka-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Heat-curable resin composition and semiconductor device
- Patent number 11,059,973
- Issue date Jul 13, 2021
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro Tsutsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat-curable resin composition for semiconductor encapsulation and...
- Patent number 11,046,848
- Issue date Jun 29, 2021
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro Tsutsumi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Silicone-modified epoxy resin composition and semiconductor device
- Patent number 11,028,269
- Issue date Jun 8, 2021
- Shin-Etsu Chemical Co., Ltd.
- Norifumi Kawamura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Heat-curable resin composition for semiconductor encapsulation and...
- Patent number 11,001,704
- Issue date May 11, 2021
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro Tsutsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat-curable resin composition for semiconductor encapsulation and...
- Patent number 10,793,712
- Issue date Oct 6, 2020
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro Tsutsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicone-modified epoxy resin composition and semiconductor device
- Patent number 10,676,635
- Issue date Jun 9, 2020
- Shin-Etsu Chemical Co., Ltd.
- Norifumi Kawamura
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
RESIN COMPOSITION FOR ENCAPSULATION AND SEMICONDUCTOR DEVICE
- Publication number 20240263004
- Publication date Aug 8, 2024
- Shin-Etsu Chemical Co., Ltd.
- Shoichi OSADA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
THERMOSETTING RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
- Publication number 20230312909
- Publication date Oct 5, 2023
- Shin-Etsu Chemical Co., Ltd.
- Shoichi OSADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION FOR ENCAPSULATION AND SEMICONDUCTOR DEVICE
- Publication number 20220372274
- Publication date Nov 24, 2022
- Shin-Etsu Chemical Co., Ltd.
- Shoichi OSADA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
HEAT-CURABLE MALEIMIDE RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
- Publication number 20210024749
- Publication date Jan 28, 2021
- Shin-Etsu Chemical Co., Ltd.
- Shoichi OSADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICON...
- Publication number 20210002474
- Publication date Jan 7, 2021
- Shin-Etsu Chemical Co., Ltd.
- Shoichi OSADA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SILICONE-MODIFIED EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
- Publication number 20200392340
- Publication date Dec 17, 2020
- Shin-Etsu Chemical Co., Ltd.
- Norifumi KAWAMURA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
HEAT-CURABLE RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND...
- Publication number 20200048455
- Publication date Feb 13, 2020
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro TSUTSUMI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
HEAT-CURABLE RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
- Publication number 20200048464
- Publication date Feb 13, 2020
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro TSUTSUMI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
HEAT-CURABLE RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND...
- Publication number 20200048454
- Publication date Feb 13, 2020
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro TSUTSUMI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SILICONE-MODIFIED EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
- Publication number 20190144704
- Publication date May 16, 2019
- Shin-Etsu Chemical Co., Ltd.
- Norifumi KAWAMURA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Semiconductor Encapsulating Resin Composition and Semiconductor Device
- Publication number 20190127580
- Publication date May 2, 2019
- Shin-Etsu Chemical Co., Ltd.
- Shoichi Osada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SILICONE-MODIFIED EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
- Publication number 20180334567
- Publication date Nov 22, 2018
- Shin-Etsu Chemical Co., Ltd.
- Norifumi KAWAMURA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Norifumi KAWAMURA

Person

Patents Grantslast 30 patents

Heat-curable resin composition and semiconductor device

Heat-curable resin composition for semiconductor encapsulation and...

Silicone-modified epoxy resin composition and semiconductor device

Heat-curable resin composition for semiconductor encapsulation and...

Heat-curable resin composition for semiconductor encapsulation and...

Silicone-modified epoxy resin composition and semiconductor device

Patents Applicationslast 30 patents

RESIN COMPOSITION FOR ENCAPSULATION AND SEMICONDUCTOR DEVICE

THERMOSETTING RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

RESIN COMPOSITION FOR ENCAPSULATION AND SEMICONDUCTOR DEVICE

HEAT-CURABLE MALEIMIDE RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICON...

SILICONE-MODIFIED EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

HEAT-CURABLE RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND...

HEAT-CURABLE RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

HEAT-CURABLE RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND...

SILICONE-MODIFIED EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

Semiconductor Encapsulating Resin Composition and Semiconductor Device

SILICONE-MODIFIED EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE