Norifumi Kohama

Person

Koshi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Parameter adjustment method of bonding apparatus and bonding system
- Patent number 11,721,596
- Issue date Aug 8, 2023
- Tokyo Electron Limited
- Norifumi Kohama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing method and plasma processing apparatus
- Patent number 11,574,808
- Issue date Feb 7, 2023
- Tokyo Electron Limited
- Satoshi Itoh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing apparatus and substrate processing method
- Patent number 11,482,431
- Issue date Oct 25, 2022
- Tokyo Electron Limited
- Kimio Motoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 10,964,563
- Issue date Mar 30, 2021
- Tokyo Electron Limited
- Norio Wada
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND HOLDING METHOD OF SUBSTRATE
- Publication number 20240105497
- Publication date Mar 28, 2024
- TOKYO ELECTRON LIMITED
- Yosuke Omori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20230014665
- Publication date Jan 19, 2023
- TOKYO ELECTRON LIMITED
- Kimio Motoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS
- Publication number 20220262631
- Publication date Aug 18, 2022
- TOKYO ELECTRON LIMITED
- Satoshi ITOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PARAMETER ADJUSTMENT METHOD OF BONDING APPARATUS AND BONDING SYSTEM
- Publication number 20210327773
- Publication date Oct 21, 2021
- TOKYO ELECTRON LIMITED
- Norifumi Kohama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD, MODIFICATION DEVICE AND SUBSTRATE PROC...
- Publication number 20210242027
- Publication date Aug 5, 2021
- TOKYO ELECTRON LIMITED
- Norifumi Kohama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20210035827
- Publication date Feb 4, 2021
- TOKYO ELECTRON LIMITED
- Kimio Motoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20180323089
- Publication date Nov 8, 2018
- TOKYO ELECTRON LIMITED
- Norio Wada
- H01 - BASIC ELECTRIC ELEMENTS

Norifumi Kohama

Person

Patents Grantslast 30 patents

Parameter adjustment method of bonding apparatus and bonding system

Plasma processing method and plasma processing apparatus

Substrate processing apparatus and substrate processing method

Bonding apparatus and bonding method

Patents Applicationslast 30 patents

SUBSTRATE PROCESSING APPARATUS AND HOLDING METHOD OF SUBSTRATE

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS

PARAMETER ADJUSTMENT METHOD OF BONDING APPARATUS AND BONDING SYSTEM

SUBSTRATE PROCESSING METHOD, MODIFICATION DEVICE AND SUBSTRATE PROC...

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

BONDING APPARATUS AND BONDING METHOD