Norihiko TSUCHIYA

Person

Kawasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Etching method and etchant
- Patent number 10,008,426
- Issue date Jun 26, 2018
- TOSHIBA MEMORY CORPORATION
- Takehiro Nakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer with ID mark, equipment for and method of manuf...
- Patent number 7,700,381
- Issue date Apr 20, 2010
- Kabushikia Kaisha Toshiba
- Tsunetoshi Arikado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of inspecting semiconductor wafer
- Patent number 7,531,462
- Issue date May 12, 2009
- Kabushiki Kaisha Toshiba
- Katsujiro Tanzawa
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor wafer treatment method, semiconductor wafer inspectio...
- Patent number 7,314,766
- Issue date Jan 1, 2008
- Kabushiki Kaisha Toshiba
- Junji Sugamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for controlling manufacturing processes, and meth...
- Patent number 7,188,049
- Issue date Mar 6, 2007
- Kabushiki Kaisha Toshiba
- Norihiko Tsuchiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer with ID mark, equipment for and method of manuf...
- Patent number 7,057,259
- Issue date Jun 6, 2006
- Kabushiki Kaisha Toshiba
- Tsunetoshi Arikado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for evaluating an SOI substrate, evaluation processor, and m...
- Patent number 6,963,630
- Issue date Nov 8, 2005
- Kabushiki Kaisha Toshiba
- Kaori Umezawa
- G01 - MEASURING TESTING
Information Patent Grant
Method of manufacturing a substrate having shallow trench isolation
- Patent number 6,919,260
- Issue date Jul 19, 2005
- Kabushiki Kaisha Toshiba
- Kaori Umezawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Defect-position identifying method for semiconductor substrate
- Patent number 6,320,655
- Issue date Nov 20, 2001
- Kabushiki Kaisha Toshiba
- Hiroshi Matsushita
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor wafer and method of manufacturing the same
- Patent number 6,146,911
- Issue date Nov 14, 2000
- Kabushiki Kaisha Toshiba
- Norihiko Tsuchiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate having shallow trench isolation
- Patent number 5,994,756
- Issue date Nov 30, 1999
- Kabushiki Kaisha Toshiba
- Kaori Umezawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of growing thin film on semiconductor substrate and its manu...
- Patent number 5,755,877
- Issue date May 26, 1998
- Kabushiki Kaisha Toshiba
- Takanobu Kamakura
- C30 - CRYSTAL GROWTH
Information Patent Grant
Dielectrically isolated substrate and method for manufacturing the...
- Patent number 5,739,575
- Issue date Apr 14, 1998
- Kabushiki Kaisha Toshiba
- Masanori Numano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor silicon wafer and process for producing it
- Patent number 5,738,942
- Issue date Apr 14, 1998
- Kabushiki Kaisha Toshiba
- Atsuko Kubota
- C30 - CRYSTAL GROWTH
Information Patent Grant
Semiconductor device and a method for manufacturing the same
- Patent number 5,675,176
- Issue date Oct 7, 1997
- Kabushiki Kaisha Toshiba
- Yukihiro Ushiku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing Semiconductor silicon wafer
- Patent number 5,534,294
- Issue date Jul 9, 1996
- Kabushiki Kaisha Toshiba
- Atsuko Kubota
- C30 - CRYSTAL GROWTH
Information Patent Grant
System for analyzing metal impurity on the surface of a single crys...
- Patent number 5,148,457
- Issue date Sep 15, 1992
- Kabushiki Kaisha Toshiba
- Atsuko Kubota
- G01 - MEASURING TESTING
Information Patent Grant
Wafer processsing method for manufacturing wafers having contaminan...
- Patent number 5,071,776
- Issue date Dec 10, 1991
- Kabushiki Kaisha Toshiba
- Yoshiaki Matsushita
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ETCHING METHOD AND ETCHANT
- Publication number 20170154829
- Publication date Jun 1, 2017
- Kabushiki Kaisha Toshiba
- Takehiro NAKAI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Method of inspecting semiconductor wafer
- Publication number 20060281281
- Publication date Dec 14, 2006
- Katsujiro Tanzawa
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor wafer with ID mark, equipment for and method of manuf...
- Publication number 20060131696
- Publication date Jun 22, 2006
- Kabushiki Kaisha Toshiba
- Tsunetoshi Arikado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and method for controlling manufacturing processes, and meth...
- Publication number 20050233601
- Publication date Oct 20, 2005
- Norihiko Tsuchiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor wafer treatment method, semiconductor wafer inspectio...
- Publication number 20040137752
- Publication date Jul 15, 2004
- Junji Sugamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for evaluating an SOI substrate, evaluation processor, and m...
- Publication number 20030128809
- Publication date Jul 10, 2003
- Kabushiki Kaisha Toshiba
- Kaori Umezawa
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor wafer with ID mark, equipment for and method of manuf...
- Publication number 20030003608
- Publication date Jan 2, 2003
- Tsunetoshi Arikado
- H01 - BASIC ELECTRIC ELEMENTS

Norihiko TSUCHIYA

Person

Patents Grantslast 30 patents

Etching method and etchant

Semiconductor wafer with ID mark, equipment for and method of manuf...

Method of inspecting semiconductor wafer

Semiconductor wafer treatment method, semiconductor wafer inspectio...

System and method for controlling manufacturing processes, and meth...

Semiconductor wafer with ID mark, equipment for and method of manuf...

Method for evaluating an SOI substrate, evaluation processor, and m...

Method of manufacturing a substrate having shallow trench isolation

Defect-position identifying method for semiconductor substrate

Semiconductor wafer and method of manufacturing the same

Substrate having shallow trench isolation

Method of growing thin film on semiconductor substrate and its manu...

Dielectrically isolated substrate and method for manufacturing the...

Semiconductor silicon wafer and process for producing it

Semiconductor device and a method for manufacturing the same

Process for producing Semiconductor silicon wafer

System for analyzing metal impurity on the surface of a single crys...

Wafer processsing method for manufacturing wafers having contaminan...

Patents Applicationslast 30 patents

ETCHING METHOD AND ETCHANT

Method of inspecting semiconductor wafer

Semiconductor wafer with ID mark, equipment for and method of manuf...

System and method for controlling manufacturing processes, and meth...

Semiconductor wafer treatment method, semiconductor wafer inspectio...

Method for evaluating an SOI substrate, evaluation processor, and m...

Semiconductor wafer with ID mark, equipment for and method of manuf...