Norihiro Kobayashi

Person

Takasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing bonded SOI wafer
- Patent number 10,566,196
- Issue date Feb 18, 2020
- Shin-Etsu Handotai Co., Ltd.
- Norihiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a bonded SOI wafer and bonded SOI wafer
- Patent number 10,529,615
- Issue date Jan 7, 2020
- Shin-Etsu Handotai Co., Ltd.
- Kenji Meguro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing bonded SOI wafer
- Patent number 10,490,440
- Issue date Nov 26, 2019
- Shin-Etsu Handotai Co., Ltd.
- Norihiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a bonded SOI wafer
- Patent number 10,424,484
- Issue date Sep 24, 2019
- Shin-Etsu Handotai Co., Ltd.
- Toru Ishizuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing SOI wafer
- Patent number 10,204,824
- Issue date Feb 12, 2019
- Shin-Etsu Handotai Co., Ltd.
- Isao Yokokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing bonded wafer with uniform thickness distribution
- Patent number 9,859,149
- Issue date Jan 2, 2018
- Shin-Etsu Handotai Co., Ltd.
- Norihiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing bonded SOI wafer
- Patent number 9,793,154
- Issue date Oct 17, 2017
- Shin-Etsu Handotai Co., Ltd.
- Hiroji Aga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing bonded wafer
- Patent number 9,773,694
- Issue date Sep 26, 2017
- Shin-Etsu Handotai Co., Ltd.
- Norihiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating SOI wafer by ion implantation
- Patent number 9,735,045
- Issue date Aug 15, 2017
- Shin-Etsu Handotai Co., Ltd.
- Toru Ishizuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing bonded wafer
- Patent number 9,679,800
- Issue date Jun 13, 2017
- Shin-Etsu Handotai Co., Ltd.
- Norihiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing SOI wafer
- Patent number 9,240,344
- Issue date Jan 19, 2016
- Shin-Etsu Handotai Co., Ltd.
- Hiroji Aga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing bonded SOI wafer
- Patent number 9,093,497
- Issue date Jul 28, 2015
- Shin-Etsu Handotai Co., Ltd.
- Norihiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a bonded SOI wafer
- Patent number 9,076,840
- Issue date Jul 7, 2015
- Shin-Etsu Handotai Co., Ltd.
- Norihiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon epitaxial wafer, method for manufacturing the same, bonded...
- Patent number 8,823,130
- Issue date Sep 2, 2014
- Shin-Etsu Handotai Co., Ltd.
- Masahiro Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing bonded wafer
- Patent number 8,697,544
- Issue date Apr 15, 2014
- Shin-Etsu Handotai Co., Ltd.
- Tohru Ishizuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SOI wafer, semiconductor device, and method for manufacturing SOI w...
- Patent number 8,466,538
- Issue date Jun 18, 2013
- Shin-Etsu Handotai Co., Ltd.
- Tohru Ishizuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing SOI wafer
- Patent number 8,202,787
- Issue date Jun 19, 2012
- Shin-Etsu Handotai Co., Ltd.
- Tohru Ishizuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing bonded wafer
- Patent number 8,173,521
- Issue date May 8, 2012
- Shin-Etsu Handotai Co., Ltd.
- Norihiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing bonded wafer
- Patent number 8,097,523
- Issue date Jan 17, 2012
- Shin-Etsu Handotai Co., Ltd.
- Norihiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing SOI wafer and thus-manufactured SOI wafer
- Patent number 7,902,042
- Issue date Mar 8, 2011
- Shin-Etsu Handotai Co., Ltd.
- Hiroji Aga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for measuring rotation angle of bonded wafer
- Patent number 7,861,421
- Issue date Jan 4, 2011
- Shin-Etsu Handotai Co., Ltd.
- Norihiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing direct bonded wafer and direct bonded wafer
- Patent number 7,521,334
- Issue date Apr 21, 2009
- Shin-Etsu Handotai Co., Ltd.
- Norihiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing annealed wafer and annealed wafer
- Patent number 7,189,293
- Issue date Mar 13, 2007
- Shin-Etsu Handotai Co., Ltd.
- Norihiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing annealed wafer and annealed wafer
- Patent number 7,153,785
- Issue date Dec 26, 2006
- Shin-Etsu Handotai Co., Ltd.
- Norihiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing silicon wafer and silicon wafer
- Patent number 7,147,711
- Issue date Dec 12, 2006
- Shin-Etsu Handotai Co., Ltd.
- Masaro Tamatsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing process for annealed wafer and annealed wafer
- Patent number 7,081,422
- Issue date Jul 25, 2006
- Shin-Etsu Handotai Co., Ltd.
- Yoshinori Hayamizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for heat treatment of silicon wafers and silicon wafer
- Patent number 7,011,717
- Issue date Mar 14, 2006
- Shin-Etsu Handotai Co., Ltd.
- Norihiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing silicon wafer
- Patent number 6,878,645
- Issue date Apr 12, 2005
- Shin-Etsu Handotai Co., Ltd.
- Norihiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Annealed wafer manufacturing method and annealed wafer
- Patent number 6,841,450
- Issue date Jan 11, 2005
- Shin-Etsu Handotai Co., Ltd.
- Norihiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for heat treatment of silicon wafers and silicon wafer
- Patent number 6,809,015
- Issue date Oct 26, 2004
- Shin-Etsu Handotai Co., Ltd.
- Norihiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING BONDED SOI WAFER
- Publication number 20190221470
- Publication date Jul 18, 2019
- Shin-Etsu Handotai Co., Ltd.
- Norihiro KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING SOI WAFER
- Publication number 20180144975
- Publication date May 24, 2018
- Shin-Etsu Handotai Co., Ltd.
- Isao YOKOKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING BONDED SOI WAFER
- Publication number 20180122639
- Publication date May 3, 2018
- Shin-Etsu Handotai Co., Ltd.
- Norihiro KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A BONDED SOI WAFER
- Publication number 20170345663
- Publication date Nov 30, 2017
- Shin-Etsu Handotai Co., Ltd.
- Toru ISHIZUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A BONDED SOI WAFER AND BONDED SOI WAFER
- Publication number 20170033002
- Publication date Feb 2, 2017
- Shin-Etsu Handotai Co., Ltd.
- Kenji MEGURO
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD FOR MANUFACTURING BONDED SOI WAFER
- Publication number 20160372363
- Publication date Dec 22, 2016
- Shin-Etsu Handotai Co., Ltd.
- Hiroji Aga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING BONDED WAFER
- Publication number 20160365273
- Publication date Dec 15, 2016
- Shin-Etsu Handotai Co., Ltd.
- Norihiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING BONDED WAFER
- Publication number 20160204024
- Publication date Jul 14, 2016
- Shin-Etsu Handotai Co., Ltd.
- Norihiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRODUCING BONDED WAFER
- Publication number 20160118294
- Publication date Apr 28, 2016
- Shin-Etsu Handotai Co., Ltd.
- Norihiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING BONDED WAFER
- Publication number 20160079114
- Publication date Mar 17, 2016
- SHIN-ETSU HAN-DOTAI CO., LTD.
- Toru ISHIZUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SOI WAFER AND SOI WAFER
- Publication number 20150340279
- Publication date Nov 26, 2015
- Shin-Etsu Handotai Co., Ltd.
- Norihiro KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING BONDED SOI WAFER
- Publication number 20150017783
- Publication date Jan 15, 2015
- SHINE-ETSU HANDOTAI CO., LTD.
- Norihiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SOI WAFER
- Publication number 20140329372
- Publication date Nov 6, 2014
- Shin-Etsu Handotai Co., Ltd.
- Hiroji Aga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A BONDED SOI WAFER
- Publication number 20140322895
- Publication date Oct 30, 2014
- Shin-Etsu Handotai Co., Ltd.
- Norihiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON EPITAXIAL WAFER, METHOD FOR MANUFACTURING THE SAME, BONDED...
- Publication number 20120326268
- Publication date Dec 27, 2012
- Shin-Etsu Handotai Co., Ltd.
- Masahiro Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SOI WAFER
- Publication number 20110223740
- Publication date Sep 15, 2011
- Shin-Etsu Handotai Co., Ltd.
- Tohru Ishizuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING BONDED WAFER
- Publication number 20110212598
- Publication date Sep 1, 2011
- Shin-Etsu Handotai Co., Ltd.
- Tohru Ishizuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING BONDED WAFER
- Publication number 20110151643
- Publication date Jun 23, 2011
- Shin-Etsu Handotai Co., Ltd.
- Norihiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING BONDED WAFER
- Publication number 20110104870
- Publication date May 5, 2011
- Shin-Etsu Handotai Co., Ltd.
- Norihiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOI WAFER, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SOI W...
- Publication number 20100314722
- Publication date Dec 16, 2010
- Shin-Etsu Handotai Co., Ltd.
- Tohru Ishizuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MEASURING ROTATION ANGLE OF BONDED WAFER
- Publication number 20100132205
- Publication date Jun 3, 2010
- Shin-Etsu Handotai Co., Ltd.
- Norihiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING BONDED WAFER
- Publication number 20100120223
- Publication date May 13, 2010
- Shin-Etsu Handotai Co., Ltd.
- Norihiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method Of Manufacturing Soi Wafer And Thus-Manufactured Soi Wafer
- Publication number 20080128851
- Publication date Jun 5, 2008
- Shin-Etsu Handotai Co., Ltd.
- Hiroji Aga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing Direct Bonded Wafer and Direct Bonded Wafer
- Publication number 20080102603
- Publication date May 1, 2008
- Shin-Etsu Handotai Co., Ltd.
- Norihiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing process for annealed wafer and annealed wafer
- Publication number 20060121291
- Publication date Jun 8, 2006
- SHIN-ETSU HANDOTAI CO., LTD.
- Yoshinori Hayamizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for heat treatment of silicon wafers and silicon wafer
- Publication number 20050025691
- Publication date Feb 3, 2005
- Shin-Etsu Handotai Co., Ltd.
- Norihiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Production method for anneal wafer and anneal wafer
- Publication number 20040231759
- Publication date Nov 25, 2004
- Norihiro Kobayashi
- C30 - CRYSTAL GROWTH
Information Patent Application
Production method for anneal wafer and anneal wafer
- Publication number 20040192071
- Publication date Sep 30, 2004
- Norihiro Kobayashi
- C30 - CRYSTAL GROWTH
Information Patent Application
Method for manufacturing silicon wafer
- Publication number 20040023518
- Publication date Feb 5, 2004
- Norihiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of producing silicon wafer and silicon wafer
- Publication number 20040003769
- Publication date Jan 8, 2004
- Masaro Tamatsuka
- C30 - CRYSTAL GROWTH

Norihiro Kobayashi

Person

Patents Grantslast 30 patents

Method for manufacturing bonded SOI wafer

Method for manufacturing a bonded SOI wafer and bonded SOI wafer

Method for manufacturing bonded SOI wafer

Method for manufacturing a bonded SOI wafer

Method for producing SOI wafer

Method of producing bonded wafer with uniform thickness distribution

Method for manufacturing bonded SOI wafer

Method for manufacturing bonded wafer

Method of fabricating SOI wafer by ion implantation

Method for manufacturing bonded wafer

Method for manufacturing SOI wafer

Method for manufacturing bonded SOI wafer

Method for manufacturing a bonded SOI wafer

Silicon epitaxial wafer, method for manufacturing the same, bonded...

Method for manufacturing bonded wafer

SOI wafer, semiconductor device, and method for manufacturing SOI w...

Method for manufacturing SOI wafer

Method for manufacturing bonded wafer

Method for manufacturing bonded wafer

Method of manufacturing SOI wafer and thus-manufactured SOI wafer

Method for measuring rotation angle of bonded wafer

Method for producing direct bonded wafer and direct bonded wafer

Method of producing annealed wafer and annealed wafer

Method of producing annealed wafer and annealed wafer

Method of producing silicon wafer and silicon wafer

Manufacturing process for annealed wafer and annealed wafer

Method for heat treatment of silicon wafers and silicon wafer

Method for manufacturing silicon wafer

Annealed wafer manufacturing method and annealed wafer

Method for heat treatment of silicon wafers and silicon wafer

Patents Applicationslast 30 patents

METHOD FOR MANUFACTURING BONDED SOI WAFER

METHOD FOR PRODUCING SOI WAFER

METHOD FOR MANUFACTURING BONDED SOI WAFER

METHOD FOR MANUFACTURING A BONDED SOI WAFER

METHOD FOR MANUFACTURING A BONDED SOI WAFER AND BONDED SOI WAFER

METHOD FOR MANUFACTURING BONDED SOI WAFER

METHOD FOR MANUFACTURING BONDED WAFER

METHOD FOR MANUFACTURING BONDED WAFER

METHOD OF PRODUCING BONDED WAFER

METHOD OF MANUFACTURING BONDED WAFER

METHOD FOR MANUFACTURING SOI WAFER AND SOI WAFER

METHOD FOR MANUFACTURING BONDED SOI WAFER

METHOD FOR MANUFACTURING SOI WAFER

METHOD FOR MANUFACTURING A BONDED SOI WAFER

SILICON EPITAXIAL WAFER, METHOD FOR MANUFACTURING THE SAME, BONDED...

METHOD FOR MANUFACTURING SOI WAFER

METHOD FOR MANUFACTURING BONDED WAFER

METHOD FOR MANUFACTURING BONDED WAFER

METHOD FOR MANUFACTURING BONDED WAFER

SOI WAFER, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SOI W...

METHOD FOR MEASURING ROTATION ANGLE OF BONDED WAFER

METHOD FOR MANUFACTURING BONDED WAFER

Method Of Manufacturing Soi Wafer And Thus-Manufactured Soi Wafer

Method for Producing Direct Bonded Wafer and Direct Bonded Wafer

Manufacturing process for annealed wafer and annealed wafer

Method for heat treatment of silicon wafers and silicon wafer

Production method for anneal wafer and anneal wafer

Production method for anneal wafer and anneal wafer

Method for manufacturing silicon wafer

Method of producing silicon wafer and silicon wafer