Norihisa IMAIZUMI

Person

Kariya-city, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Motor control device
- Patent number 11,824,475
- Issue date Nov 21, 2023
- Denso Corporation
- Kenji Matsuda
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Electronic device and method for manufacturing same
- Patent number 9,941,182
- Issue date Apr 10, 2018
- Denso Corporation
- Norihisa Imaizumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 9,686,854
- Issue date Jun 20, 2017
- Denso Corporation
- Yuuki Sanada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with resin mold
- Patent number 9,087,924
- Issue date Jul 21, 2015
- Denso Corporation
- Tetsuto Yamagishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with resin mold
- Patent number 8,749,055
- Issue date Jun 10, 2014
- Denso Corporation
- Tetsuto Yamagishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with resin mold
- Patent number 8,207,607
- Issue date Jun 26, 2012
- Denso Corporation
- Tetsuto Yamagishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,179,688
- Issue date May 15, 2012
- Denso Corporation
- Yutaka Fukuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 7,843,700
- Issue date Nov 30, 2010
- Denso Corporation
- Yutaka Fukuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device having wiring substrate and lead frame
- Patent number 7,612,434
- Issue date Nov 3, 2009
- Denso Corporation
- Norihisa Imaizumi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device having wiring substrate and lead frame
- Patent number 7,304,370
- Issue date Dec 4, 2007
- Denso Corporation
- Norihisa Imaizumi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering paste, soldering method, and surface-mounted type electro...
- Patent number 6,488,781
- Issue date Dec 3, 2002
- Denso Corporation
- Akira Tanahashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering method using soldering flux and soldering paste
- Patent number 6,142,363
- Issue date Nov 7, 2000
- Nippondenso Co., Ltd.
- Akira Tanahashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering flux, soldering paste and soldering method using the same
- Patent number 5,919,317
- Issue date Jul 6, 1999
- Nippondenso Co., Ltd.
- Akira Tanahashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTUR...
- Publication number 20220115283
- Publication date Apr 14, 2022
- DENSO CORPORATION
- Akihiro YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOTOR CONTROL DEVICE
- Publication number 20210328539
- Publication date Oct 21, 2021
- DENSO CORPORATION
- Kenji MATSUDA
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
ELECTRONIC APPARATUS
- Publication number 20160163613
- Publication date Jun 9, 2016
- Denso Corporation
- Shinya UCHIBORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC APPARATUS
- Publication number 20160150655
- Publication date May 26, 2016
- DENSO CORPORATION
- Masayuki TAKENAKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20160104653
- Publication date Apr 14, 2016
- Norihisa IMAIZUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20150319840
- Publication date Nov 5, 2015
- Denso Corporation
- Yuuki SANADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140217620
- Publication date Aug 7, 2014
- DENSO CORPORATION
- Tetsuto Yamagishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20120223444
- Publication date Sep 6, 2012
- DENSO CORPORATION
- Tetsuto Yamagishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20110044009
- Publication date Feb 24, 2011
- DENSO CORPORATION
- Yutaka Fukuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and method for manufacturing the same
- Publication number 20090152714
- Publication date Jun 18, 2009
- DENSO CORPORATION
- Tetsuto Yamagishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device having wiring substrate and lead frame
- Publication number 20080061410
- Publication date Mar 13, 2008
- DENSO CORPORATION
- Norihisa Imaizumi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device having metallic lead and electronic device hav...
- Publication number 20070075419
- Publication date Apr 5, 2007
- DENSO CORPORATION
- Yutaka Fukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for manufacturing the same
- Publication number 20050231925
- Publication date Oct 20, 2005
- DENSO Corporation
- Yutaka Fukuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic device having wiring substrate and lead frame
- Publication number 20050151229
- Publication date Jul 14, 2005
- DENSO Corporation
- Norihisa Imaizumi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Norihisa IMAIZUMI

Person

Patents Grantslast 30 patents

Motor control device

Electronic device and method for manufacturing same

Electronic device

Semiconductor device with resin mold

Semiconductor device with resin mold

Semiconductor device with resin mold

Semiconductor device

Semiconductor device

Electronic device having wiring substrate and lead frame

Electronic device having wiring substrate and lead frame

Soldering paste, soldering method, and surface-mounted type electro...

Soldering method using soldering flux and soldering paste

Soldering flux, soldering paste and soldering method using the same

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTUR...

MOTOR CONTROL DEVICE

ELECTRONIC APPARATUS

ELECTRONIC APPARATUS

ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING SAME

ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor device

Semiconductor device and method for manufacturing the same

Electronic Device having wiring substrate and lead frame

Semiconductor device having metallic lead and electronic device hav...

Semiconductor device and method for manufacturing the same

Electronic device having wiring substrate and lead frame