Norikatsu Akiyama

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Resin composite electrolytic copper foil, copper clad laminate and...
- Patent number 9,949,371
- Issue date Apr 17, 2018
- Mitsubishi Gas Chemical Company, Inc.
- Mitsuru Nozaki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
RESIN COMPOSITE ELECTROLYTIC COPPER FOIL, COPPER CLAD LAMINATE AND...
- Publication number 20160360615
- Publication date Dec 8, 2016
- Mitsubishi Gas Chemical Company, Inc.
- Mitsuru NOZAKI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
RESIN COMPOSITE ELECTROLYTIC COPPER FOIL, COPPER CLAD LAMINATE AND...
- Publication number 20120189859
- Publication date Jul 26, 2012
- PI R&D CO., LTD.
- Mitsuru Nozaki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
RESIN COMPOSITE COPPER FOIL
- Publication number 20110281126
- Publication date Nov 17, 2011
- Mitsuru Nozaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR