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Resin-coated metal foil
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Patent number 6,485,833
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Issue date Nov 26, 2002
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Nisshinbo Industries, Inc.
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Yasuo Imashiro
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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Adhesive film for semiconductor package
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Patent number 6,440,258
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Issue date Aug 27, 2002
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Nisshinbo Industries, Inc.
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Yasuo Imashiro
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C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
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LCP bonding method
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Patent number 6,331,226
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Issue date Dec 18, 2001
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Nisshinbo Industries, Inc.
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Yasuo Imashiro
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C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
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One-pack type epoxy resin composition
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Patent number 6,225,417
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Issue date May 1, 2001
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Nisshinbo Industries, Inc.
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Yasuo Imashiro
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C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
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Epoxy resin composition
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Patent number 6,103,836
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Issue date Aug 15, 2000
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Nisshinbo Industries, Inc.
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Yasuo Imashiro
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C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
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