Norio Kawatani

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Kanagawa, JP

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Patents Grantslast 30 patents

Information Patent Grant
Electronic-component alignment method
- Patent number 7,594,319
- Issue date Sep 29, 2009
- Sony Corporation
- Atsushi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic-component alignment method and apparatus therefor
- Patent number 7,251,883
- Issue date Aug 7, 2007
- Sony Corporation
- Atsushi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermocompression bonding equipment
- Patent number 5,698,068
- Issue date Dec 16, 1997
- Sony Corporation
- Iwao Ichikawa
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Pressure-bonding unit and pressure-bonding head unit
- Patent number 5,683,026
- Issue date Nov 4, 1997
- Sony Corporation
- Norio Kawatani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bonding apparatus, thermocompression bonding meth...
- Patent number 5,439,161
- Issue date Aug 8, 1995
- Sony Corporation
- Norio Kawatani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for positioning circuit components at predetermined posit...
- Patent number 4,733,462
- Issue date Mar 29, 1988
- Sony Corporation
- Norio Kawatani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC-COMPONENT ALIGNMENT METHOD AND APPARATUS THEREFOR
- Publication number 20060218781
- Publication date Oct 5, 2006
- Atsushi Nakamura
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Electronic-component alignment method and apparatus therefor
- Publication number 20050071990
- Publication date Apr 7, 2005
- Atsushi Nakamura
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS