Membership
Tour
Register
Log in
Norio Wada
Follow
Person
Kikuchi-gun, JP
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Substrate processing apparatus and substrate processing method
Patent number
11,482,431
Issue date
Oct 25, 2022
Tokyo Electron Limited
Kimio Motoda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding apparatus and bonding method
Patent number
10,964,563
Issue date
Mar 30, 2021
Tokyo Electron Limited
Norio Wada
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding apparatus, bonding system and bonding method
Patent number
9,469,093
Issue date
Oct 18, 2016
Tokyo Electron Limited
Norio Wada
B32 - LAYERED PRODUCTS
Information
Patent Grant
Bonding method, bonding apparatus and bonding system
Patent number
9,165,803
Issue date
Oct 20, 2015
Tokyo Electron Limited
Goro Furutani
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Dye adsorption apparatus and dye adsorption method
Patent number
9,093,222
Issue date
Jul 28, 2015
Tokyo Electron Limited
Goro Furutani
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Grant
Bonding apparatus, bonding system and bonding method
Patent number
9,005,385
Issue date
Apr 14, 2015
Tokyo Electron Limited
Norio Wada
B32 - LAYERED PRODUCTS
Patents Applications
last 30 patents
Information
Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
Publication number
20230014665
Publication date
Jan 19, 2023
TOKYO ELECTRON LIMITED
Kimio Motoda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
Publication number
20210035827
Publication date
Feb 4, 2021
TOKYO ELECTRON LIMITED
Kimio Motoda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING APPARATUS AND BONDING METHOD
Publication number
20180323089
Publication date
Nov 8, 2018
TOKYO ELECTRON LIMITED
Norio Wada
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING METHOD, BONDING APPARATUS AND BONDING SYSTEM
Publication number
20140329341
Publication date
Nov 6, 2014
TOKYO ELECTRON LIMITED
Goro Furutani
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING APPARATUS, BONDING SYSTEM AND BONDING METHOD
Publication number
20140318680
Publication date
Oct 30, 2014
TOKYO ELECTRON LIMITED
Norio Wada
B32 - LAYERED PRODUCTS
Information
Patent Application
BONDING APPARATUS, BONDING SYSTEM AND BONDING METHOD
Publication number
20140318711
Publication date
Oct 30, 2014
TOKYO ELECTRON LIMITED
Norio Wada
B32 - LAYERED PRODUCTS
Information
Patent Application
DYE ADSORPTION DEVICE, DYE ADSORPTION METHOD AND SUBSTRATE TREATMEN...
Publication number
20130323934
Publication date
Dec 5, 2013
TOKYO ELECTRON LIMITED
Norio Wada
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DYE ADSORPTION APPARATUS AND DYE ADSORPTION METHOD
Publication number
20130316485
Publication date
Nov 28, 2013
TOKYO ELECTRON LIMITED
Goro Furutani
H01 - BASIC ELECTRIC ELEMENTS