Noritaka Oyama

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Osaka-fu, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method for production of semiconductor package
- Patent number RE38961
- Issue date Jan 31, 2006
- Casio Computer Co., Ltd.
- Atsushi Okuno
- 438 - Semiconductor device manufacturing: process
Information Patent Grant
Fabrication method of an electronic component
- Patent number 6,579,748
- Issue date Jun 17, 2003
- Sanyu Rec Co., Ltd.
- Atsushi Okuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for production of semiconductor package
- Patent number 6,063,646
- Issue date May 16, 2000
- Japan Rec Co., Ltd.
- Atsushi Okuno
- H01 - BASIC ELECTRIC ELEMENTS