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Noriyoshi Hosono
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Saitama, JP
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Patents Grants
last 30 patents
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Patent Grant
Holding jig, semiconductor wafer grinding method, semiconductor waf...
Patent number
8,212,345
Issue date
Jul 3, 2012
Shin-Etsu Polymer Co., Ltd.
Kiyofumi Tanaka
B24 - GRINDING POLISHING
Information
Patent Grant
Holding jig, semiconductor wafer grinding method, semiconductor waf...
Patent number
7,875,501
Issue date
Jan 25, 2011
Shin-Etsu Polymer Co., Ltd.
Kiyofumi Tanaka
B24 - GRINDING POLISHING
Patents Applications
last 30 patents
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Patent Application
HOLDING JIG, SEMICONDUCTOR WAFER GRINDING METHOD, SEMICONDUCTOR WAF...
Publication number
20110281509
Publication date
Nov 17, 2011
Lintec Corporation
KIYOFUMI TANAKA
B24 - GRINDING POLISHING
Information
Patent Application
HOLDING JIG, SEMICONDUCTOR WAFER GRINDING METHOD, SEMICONDUCTOR WAF...
Publication number
20090081852
Publication date
Mar 26, 2009
Shin-etsu Polymer Co., Ltd.
Kiyofumi Tanaka
B24 - GRINDING POLISHING
Information
Patent Application
Fixing carrier, fixing carrier manufacturing method, method of usin...
Publication number
20060243620
Publication date
Nov 2, 2006
Shin-etsu Polymer Co., Ltd.
Satoshi Odashima
H01 - BASIC ELECTRIC ELEMENTS