Noriyuki KIMURA

Person

Chiba, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Resin-encapsulated semiconductor device and method of manufacturing...
- Patent number 9,275,972
- Issue date Mar 1, 2016
- Seiko Instruments Inc.
- Noriyuki Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array semiconductor package and method of manufacturing t...
- Patent number 9,245,864
- Issue date Jan 26, 2016
- Seiko Instruments Inc.
- Noriyuki Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin-encapsulated semiconductor device and method of manufacturing...
- Patent number 9,136,247
- Issue date Sep 15, 2015
- Seiko Instruments Inc.
- Noriyuki Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin-encapsulated semiconductor device and method of manufacturing...
- Patent number 8,994,160
- Issue date Mar 31, 2015
- Seiko Instruments Inc.
- Noriyuki Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array semiconductor package and method of manufacturing t...
- Patent number 8,940,629
- Issue date Jan 27, 2015
- Seiko Instruments Inc.
- Noriyuki Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical sensor and method of manufacturing the optical sensor
- Patent number 8,785,839
- Issue date Jul 22, 2014
- Seiko Instruments Inc.
- Hitoshi Takeuchi
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 8,703,532
- Issue date Apr 22, 2014
- Seiko Instruments Inc.
- Noriyuki Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for resin sealed semiconductor device
- Patent number 7,550,322
- Issue date Jun 23, 2009
- Seiko Instruments Inc.
- Noriyuki Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for resin sealed semiconductor device
- Patent number 7,271,035
- Issue date Sep 18, 2007
- Seiko Instruments Inc.
- Noriyuki Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a bump electrode
- Patent number 6,563,216
- Issue date May 13, 2003
- Seiko Instruments Inc.
- Noriyuki Kimura
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
RESIN-ENCAPSULATD SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING...
- Publication number 20160086826
- Publication date Mar 24, 2016
- SEIKO INSTRUMENTS INC.
- Noriyuki KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING...
- Publication number 20150147848
- Publication date May 28, 2015
- SEIKO INSTRUMENTS INC.
- Noriyuki KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL GRID ARRAY SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING T...
- Publication number 20150123277
- Publication date May 7, 2015
- SEIKO INSTRUMENTS INC.
- Noriyuki KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING...
- Publication number 20140225239
- Publication date Aug 14, 2014
- Seiko Instruments Inc.
- Noriyuki KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20140117544
- Publication date May 1, 2014
- Seiko Instruments Inc.
- Noriyuki KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING...
- Publication number 20140084435
- Publication date Mar 27, 2014
- Seiko Instruments Inc.
- Noriyuki KIMURA
- H01 - BASIC ELECTRIC ELEMENTS

Noriyuki KIMURA

Person

Patents Grantslast 30 patents

Resin-encapsulated semiconductor device and method of manufacturing...

Ball grid array semiconductor package and method of manufacturing t...

Resin-encapsulated semiconductor device and method of manufacturing...

Resin-encapsulated semiconductor device and method of manufacturing...

Ball grid array semiconductor package and method of manufacturing t...

Optical sensor and method of manufacturing the optical sensor

Semiconductor device and manufacturing method thereof

Manufacturing method for resin sealed semiconductor device

Manufacturing method for resin sealed semiconductor device

Semiconductor device having a bump electrode

Patents Applicationslast 30 patents

RESIN-ENCAPSULATD SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING...

RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING...

BALL GRID ARRAY SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING T...

RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING...