Noriyuki KIMURA

Person

Chiba-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Pre-molded substrate, method of manufacturing pre-molded substrate,...
- Patent number 11,011,439
- Issue date May 18, 2021
- ABLIC INC.
- Noriyuki Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin-encapsulated semiconductor device and method of manufacturing...
- Patent number 10,600,752
- Issue date Mar 24, 2020
- ABLIC Inc.
- Noriyuki Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin-encapsulated semiconductor device and method of manufacturing...
- Patent number 10,354,968
- Issue date Jul 16, 2019
- ABLIC Inc.
- Noriyuki Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin-encapsulated semiconductor device
- Patent number 9,935,030
- Issue date Apr 3, 2018
- SII Semiconductor Corporation
- Noriyuki Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin-encapsulatd semiconductor device and method of manufacturing...
- Patent number 9,728,478
- Issue date Aug 8, 2017
- SII Semiconductor Corporation
- Noriyuki Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin-encapsulated semiconductor device and method of manufacturing...
- Patent number 9,508,684
- Issue date Nov 29, 2016
- SII Semiconductor Corporation
- Noriyuki Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 9,490,224
- Issue date Nov 8, 2016
- SII SEMICONDUCTOR CORPORATION
- Noriyuki Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a resin-encapsulated semiconductor device
- Patent number 9,431,273
- Issue date Aug 30, 2016
- SII Semiconductor Corporation
- Noriyuki Kimura
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PRE-MOLDED SUBSTRATE, METHOD OF MANUFACTURING PRE-MOLDED SUBSTRATE,...
- Publication number 20190355635
- Publication date Nov 21, 2019
- ABLIC Inc.
- Noriyuki KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING...
- Publication number 20190333888
- Publication date Oct 31, 2019
- ABLIC Inc.
- Noriyuki KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING...
- Publication number 20180286827
- Publication date Oct 4, 2018
- ABLIC Inc.
- Noriyuki KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE
- Publication number 20170263521
- Publication date Sep 14, 2017
- SII Semiconductor Corporation
- Noriyuki KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN-ENCAPSULATD SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING...
- Publication number 20170025320
- Publication date Jan 26, 2017
- SII Semiconductor Corporation
- Noriyuki KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING...
- Publication number 20160260686
- Publication date Sep 8, 2016
- SII Semiconductor Corporation
- Noriyuki KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SENSOR AND METHOD OF MANUFACTURING THE OPTICAL SENSOR
- Publication number 20120248298
- Publication date Oct 4, 2012
- Hitoshi Takeuchi
- G01 - MEASURING TESTING
Information Patent Application
Ball grid array semiconductor package and method of manufacturing t...
- Publication number 20120068340
- Publication date Mar 22, 2012
- Noriyuki Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20100200982
- Publication date Aug 12, 2010
- Noriyuki Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing method for resin sealed semiconductor device
- Publication number 20080044948
- Publication date Feb 21, 2008
- Noriyuki Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing method for resin sealed semiconductor device
- Publication number 20050158917
- Publication date Jul 21, 2005
- Noriyuki Kimura
- H01 - BASIC ELECTRIC ELEMENTS

Noriyuki KIMURA

Person

Patents Grantslast 30 patents

Pre-molded substrate, method of manufacturing pre-molded substrate,...

Resin-encapsulated semiconductor device and method of manufacturing...

Resin-encapsulated semiconductor device and method of manufacturing...

Resin-encapsulated semiconductor device

Resin-encapsulatd semiconductor device and method of manufacturing...

Resin-encapsulated semiconductor device and method of manufacturing...

Semiconductor device and manufacturing method thereof

Method for manufacturing a resin-encapsulated semiconductor device

Patents Applicationslast 30 patents

PRE-MOLDED SUBSTRATE, METHOD OF MANUFACTURING PRE-MOLDED SUBSTRATE,...

RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING...

RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING...

RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE

RESIN-ENCAPSULATD SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING...

RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING...

OPTICAL SENSOR AND METHOD OF MANUFACTURING THE OPTICAL SENSOR

Ball grid array semiconductor package and method of manufacturing t...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Manufacturing method for resin sealed semiconductor device

Manufacturing method for resin sealed semiconductor device