Noriyuki KIRIKAE

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Electrically conductive adhesive film and dicing-die bonding film u...
- Patent number 11,230,649
- Issue date Jan 25, 2022
- Furukawa Electric Co., Ltd.
- Naoaki Mihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically conductive adhesive film and dicing-die bonding film u...
- Patent number 11,193,047
- Issue date Dec 7, 2021
- Furukawa Electric Co., Ltd.
- Naoaki Mihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically conductive adhesive film and dicing-die bonding film u...
- Patent number 11,136,479
- Issue date Oct 5, 2021
- Furukawa Electric Co., Ltd.
- Naoaki Mihara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Film-like adhesive and method for producing semiconductor package u...
- Patent number 11,139,261
- Issue date Oct 5, 2021
- Furukawa Electric Co., Ltd.
- Minoru Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically conductive adhesive film and dicing-die bonding film u...
- Patent number 11,098,226
- Issue date Aug 24, 2021
- Furukawa Electric Co., Ltd.
- Naoaki Mihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically conductive adhesive film and dicing-die bonding film u...
- Patent number 11,066,577
- Issue date Jul 20, 2021
- Furukawa Electric Co., Ltd.
- Naoaki Mihara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Electrically conductive composition
- Patent number 10,689,550
- Issue date Jun 23, 2020
- Furukawa Electric Co., Ltd.
- Naoaki Mihara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Conductive adhesive composition
- Patent number 10,563,096
- Issue date Feb 18, 2020
- Furukawa Electric Co., Ltd.
- Masami Aoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive film and semiconductor package using adhesive film
- Patent number 10,115,707
- Issue date Oct 30, 2018
- Furukawa Electric Co., Ltd.
- Noriyuki Kirikae
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
FILM-LIKE ADHESIVE AND METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE U...
- Publication number 20190181113
- Publication date Jun 13, 2019
- FURUKAWA ELECTRIC CO., LTD.
- Minoru MORITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICALLY CONDUCTIVE ADHESIVE FILM AND DICING-DIE BONDING FILM U...
- Publication number 20190016928
- Publication date Jan 17, 2019
- FURUKAWA ELECTRIC CO., LTD.
- Naoaki MIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICALLY CONDUCTIVE ADHESIVE FILM AND DICING-DIE BONDING FILM U...
- Publication number 20190016929
- Publication date Jan 17, 2019
- FURUKAWA ELECTRIC CO., LTD.
- Naoaki MIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICALLY CONDUCTIVE ADHESIVE FILM AND DICING-DIE BONDING FILM U...
- Publication number 20180346766
- Publication date Dec 6, 2018
- Furukawa Electric Co., Ltd,
- Naoaki Mihara
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ELECTRICALLY CONDUCTIVE ADHESIVE FILM AND DICING-DIE BONDING FILM U...
- Publication number 20180346767
- Publication date Dec 6, 2018
- FURUKAWA ELECTRIC CO., LTD.
- Naoaki MIHARA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ELECTRICALLY CONDUCTIVE ADHESIVE FILM AND DICING DIE BONDING FILM
- Publication number 20180294242
- Publication date Oct 11, 2018
- FURUKAWA ELECTRIC CO., LTD.
- Naoaki MIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICALLY CONDUCTIVE ADHESIVE FILM AND DICING DIE BONDING FILM
- Publication number 20180026003
- Publication date Jan 25, 2018
- FURUKAWA ELECTRIC CO., LTD.
- Naoaki MIHARA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ELECTRICALLY CONDUCTIVE COMPOSITION
- Publication number 20170369746
- Publication date Dec 28, 2017
- FURUKAWA ELECTRIC CO., LTD.
- Naoaki MIHARA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CONDUCTIVE ADHESIVE COMPOSITION
- Publication number 20170152410
- Publication date Jun 1, 2017
- FURUKAWA ELECTRIC CO., LTD.
- Masami AOYAMA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE FILM
- Publication number 20170152405
- Publication date Jun 1, 2017
- FURUKAWA ELECTRIC CO., LTD.
- Masami AOYAMA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE FILM AND SEMICONDUCTOR PACKAGE USING ADHESIVE FILM
- Publication number 20170152408
- Publication date Jun 1, 2017
- FURUKAWA ELECTRIC CO., LTD.
- Noriyuki KIRIKAE
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CONDUCTIVE ADHESIVE FILM
- Publication number 20170152411
- Publication date Jun 1, 2017
- FURUKAWA ELECTRIC CO., LTD.
- Naoaki MIHARA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
MALEIMIDE FILM
- Publication number 20170152418
- Publication date Jun 1, 2017
- FURUKAWA ELECTRIC CO., LTD.
- Masami AOYAMA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Noriyuki KIRIKAE

Person

Patents Grantslast 30 patents

Electrically conductive adhesive film and dicing-die bonding film u...

Electrically conductive adhesive film and dicing-die bonding film u...

Electrically conductive adhesive film and dicing-die bonding film u...

Film-like adhesive and method for producing semiconductor package u...

Electrically conductive adhesive film and dicing-die bonding film u...

Electrically conductive adhesive film and dicing-die bonding film u...

Electrically conductive composition

Conductive adhesive composition

Adhesive film and semiconductor package using adhesive film

Patents Applicationslast 30 patents

FILM-LIKE ADHESIVE AND METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE U...

ELECTRICALLY CONDUCTIVE ADHESIVE FILM AND DICING-DIE BONDING FILM U...

ELECTRICALLY CONDUCTIVE ADHESIVE FILM AND DICING-DIE BONDING FILM U...

ELECTRICALLY CONDUCTIVE ADHESIVE FILM AND DICING-DIE BONDING FILM U...

ELECTRICALLY CONDUCTIVE ADHESIVE FILM AND DICING-DIE BONDING FILM U...

ELECTRICALLY CONDUCTIVE ADHESIVE FILM AND DICING DIE BONDING FILM

ELECTRICALLY CONDUCTIVE ADHESIVE FILM AND DICING DIE BONDING FILM

ELECTRICALLY CONDUCTIVE COMPOSITION

CONDUCTIVE ADHESIVE COMPOSITION

ADHESIVE FILM

ADHESIVE FILM AND SEMICONDUCTOR PACKAGE USING ADHESIVE FILM

CONDUCTIVE ADHESIVE FILM

MALEIMIDE FILM