Noriyuki Ooroku

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Yokohama, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and its manufacturing method
- Patent number 7,265,035
- Issue date Sep 4, 2007
- Renesas Technology Corp.
- Hiroshi Honma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming bumps
- Patent number 6,413,850
- Issue date Jul 2, 2002
- Hitachi, Ltd.
- Noriyuki Ooroku
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor device and its manufacturing method
- Publication number 20060252233
- Publication date Nov 9, 2006
- Hiroshi Honma
- H01 - BASIC ELECTRIC ELEMENTS